DE102010042824A1 - Microfluidic module useful for analysis of fluids, comprises an integral carrier substrate with a first main surface and a second main surface lying opposite to the first main surface, a sensor arrangement, and a channel structure - Google Patents

Abstract

Microfluidic module for analysis of fluids, comprises: an integral carrier substrate (101) with a first main surface (103) and a second main surface (105) lying opposite to the first main surface; a sensor arrangement (107), where a first functional element (109) of the sensor arrangement is arranged at a first surface region of the carrier substrate; and a channel structure, which is coupled to the first main surface of the carrier substrate so that a channel region is formed between the first surface region of the carrier substrate and a second surface region of the carrier substrate. Microfluidic module for analysis of fluids, comprises: an integral carrier substrate (101) with a first main surface (103) and a second main surface (105) lying opposite to the first main surface; a sensor arrangement (107), where a first functional element (109) of the sensor arrangement is arranged at a first surface region of the carrier substrate; and a channel structure, which is coupled to the first main surface of the carrier substrate so that a channel region is formed between the first surface region of the carrier substrate and a second surface region of the carrier substrate lying opposite to the first surface region, and the channel region is surrounded by the channel structure and the carrier substrate. An independent claim is also included for producing the microfluidic module, comprising providing the integral carrier substrate with the first main surface and the second main surface lying opposite to the first main surface, providing the channel structure, and connecting the channel structure with the first main surface of the carrier substrate so that the channel region is formed between the first surface region of the carrier substrate and the second surface region of the carrier substrate lying opposite to the first surface region.

Description

Background of the invention

Healthcare is under high cost and pressure. This also applies to medical diagnostics. As a solution for this often lab-on-chip systems ("lab-on-chip" - laboratory on a chip) are considered, the microtechnologically many functions such as fluidics, optics, electronics can combine in a small cost-effective system.

In order to produce these inexpensively, plastic materials or plastic materials are used. It should be noted that fluidics have a certain, not negligible space requirements and systems should therefore have a size with which the user can still handle. Alternatives such as silicon or high-purity glasses already cause such high material costs that their use calls into question the economic goals.

However, plastic as a substrate has the disadvantage that the common integration methods for the functional structures (fluidics, optics, electronics) is not or only with increased effort by means of common technologies possible. For example, in an optical system, light sources (eg, LEDs - light-emitting diodes, eg, semiconductor-based or the like) and photodetectors (mostly silicon-based) are to be integrated with a plastic substrate. This additional expense may compensate for the material cost savings. The costs of the manufacturing process should always be kept in mind when developing lab-on-chip systems.

As already mentioned, lab-on-chip systems can have different functions. A special embodiment of a lab-on-chip system can serve, for example, to analyze a liquid or a fluid in a fluidic channel. Such a system can be used in medical diagnostics, for example for the detection of pathogens in patient samples.

Summary of the invention

It is an object of the present invention to provide a concept which enables a simplified production of a microfluidic module.

This object is achieved by a microfluidic module according to claim 1 and a method for producing a microfluidic module according to claim 24.

Embodiments of the present invention provide a microfluidic module for analyzing fluids. The microfluidic module comprises an integral (or continuous or continuous) carrier substrate having a first major surface and a second major surface opposite the first major surface. Furthermore, the microfluidic module has a sensor arrangement, wherein a first functional element of the sensor arrangement is arranged on a first surface region of the one-piece carrier substrate. Furthermore, the microfluidic module has a channel structure, which is connected to the first main surface of the carrier substrate, so that a channel region is formed between the first surface region of the carrier substrate and a second surface region of the carrier substrate opposite the first surface region of the carrier substrate, that of the channel structure and the Carrier substrate is surrounded.

The channel region may serve, for example, for receiving fluids to be analyzed (i.e., gases or liquids).

It is a core idea of embodiments of the present invention that a simplified production of a microfluidic module can be made possible when a microfluidic module has a one-piece support substrate which is connected to a channel structure to form a channel region for receiving the fluids to be analyzed, one to the Channel region adjacent sensor arrangement for detecting the required for analysis measurement data can be provided. By using a one-piece carrier substrate, which is flexible, for example, at least during manufacture, a channel region can be created in conjunction with a channel structure which is connected to the carrier substrate with minimal material and manufacturing effort (for connecting the individual elements). which can be used for recording fluids to be analyzed. The fluids in the channel region can then be analyzed by the sensor arrangement of the microfluidic module. In a production of the microfluidic module, the sensor module can be arranged, for example, on the carrier substrate and subsequently the carrier substrate folded over and connected to the channel structure such that the channel region between a first surface region of the carrier substrate on which the sensor arrangement is arranged, and an opposite second Surface area of the carrier substrate forms, and so that the channel region of the support substrate and the channel structure is surrounded.

It is an advantage of embodiments of the present invention that a simplified fabrication of a microfluidic module thereby it is made possible for the microfluidic module to have a one-piece carrier substrate which is connected to a channel structure such that a channel region is formed which is surrounded by the carrier structure and the channel structure. Embodiments of the present invention can thereby be more easily manufactured, in particular in comparison to microfluidic modules in which separate substrates are used to form a channel region, which are connected to each other in a fluid-tight manner. In embodiments of the present invention, therefore, the carrier substrate can be manufactured in a single step in a simple process (for example, using favorable printing, liquid application, and patterning processes). Subsequently, a functional element of a sensor arrangement can be produced on a surface region of the carrier substrate. In order to produce the channel region, the carrier substrate produced in one step can be folded around the mentioned channel structure, so that the channel region is formed between the carrier substrate and the channel structure. In alternative methods using a plurality of individual substrates, which are joined together, in a first step, a bottom substrate could be molded, on which an intermediate substrate is molded and then a cover substrate is molded. This production of an alternative microfluidic module therefore requires more steps than the production of microfluidic modules according to embodiments of the present invention and is thus more complicated and cost-intensive.

According to some embodiments, the sensor arrangement may further comprise a second functional element which is arranged on the second surface area of the carrier substrate and thus opposite to the first functional element of the sensor arrangement. By way of example, the first functional element can form a radiation source, and the second functional element can form a radiation detector, for example. A radiation-emitting surface of the radiation source may face the channel region of the microfluidic module. Furthermore, a radiation-sensitive surface of the radiation detector may also face the channel region. A radiation emitted by the radiation-emitting surface of the radiation source can therefore traverse the channel region and thereby traverse a liquid (or a fluid in the channel region) located in the channel region and strike the radiation-sensitive surface of the radiation detector. An optical property or its alteration and the resulting change in the radiation emitted by the radiation source through the fluid in the channel region can be detected by the radiation detector, thereby enabling an analysis of the fluid in the channel region. By using a one-piece carrier substrate, the first functional element (ie the radiation source) and the second functional element (ie the radiation detector) can be produced on a common processing surface of the carrier substrate. A common processing surface of the carrier substrate is an exposed surface of the carrier substrate during production which forms a surface of one side, for example an upper side of the carrier substrate, and which can be processed from one direction. The first functional element and the second functional element can therefore be produced during production on the same side of the carrier substrate, for example by printing, deposition and / or structuring processes, although in the finished microfluidic module the first functional element and the second functional element are arranged opposite one another. The first functional element and the second functional element can therefore be produced first on the common processing surface of the carrier substrate and subsequently the carrier substrate can be folded around the channel structure such that the channel region is arranged between the first functional element and the second functional element. This allows machining of the carrier substrate (exclusively) from one and the same side, thereby significantly reducing manufacturing costs, particularly to systems in which a carrier substrate is processed from both sides, for example printed, to functional elements from both sides to be applied to the carrier substrate.

According to further embodiments of the present invention, the channel structure may also be formed integrally with the carrier substrate. In the production of a microfluidic module in which the channel structure is formed integrally with the carrier substrate, the channel structure can be structured, for example, by a patterning process (such as laser cutting, stamping, milling or production by means of injection molding), such that upon folding over Carrier substrate, the channel region between the first surface region and the second surface region of the carrier substrate is formed. The fact that the channel structure is formed integrally with the carrier substrate allows the channel structure to be connected only in a connecting region to the first main surface of the carrier substrate in order to form the fluid-tight channel region. After the sensor arrangement has been produced, for example, the carrier substrate can be folded over such that the first main surface contacts a main surface of the channel structure. The main surface of the channel structure may, for example, be connected to the first main surface of the channel Carrier substrate are connected via a primer layer. In other words, the channel structure can be adhesively bonded to the carrier substrate (for example using an adhesive interlayer, by solvent bonding, by technical welding of the two substrates - the channel structure and the carrier substrate - or by laser welding).

The adhesive layer (the adhesive intermediate layer or adhesion promoter layer) can already be applied to the corresponding region of the fluidic substrate (the material of the channel structure) before the structuring of the channel structure (also on both sides) in order to obtain film pieces (film stacks). This adhesive layer is already structurally structured in the structuring of the channel structure. This reduces the adjustment effort between the adhesive layer and the channel structure. Furthermore, a Justageaufwand is reduced in the assembly of the overall module, since the adhesive layer is already arranged accurately on the channel structure. Another advantage of this is that the adhesive layer should as little as possible come into contact with the liquid in the channel. This embodiment is particularly advantageous when double-sided adhesive films are used as the adhesive layer. Furthermore, in particular in comparison to the dispensing of adhesive layers from the liquid phase or to sputtering processes, the adhesive layer can be applied precisely to the channel structure.

Furthermore, a plurality of pieces of film may be adhered to the corresponding surface to adjust or increase the depth of the channel (channel region). Both the adhesive layers (between the additional film layers, as well as major surfaces of the outermost film layers) and the additional film pieces are patterned simultaneously. This minimizes the adjustment effort for the corresponding layers, since the adhesive layers are already arranged precisely on the channel structure and need not be individually structured.

According to further embodiments, in which the channel structure is formed integrally with the carrier substrate, instead of structuring the carrier substrate in the production in order to obtain the channel structure, the carrier substrate can be folded into one another several times. A first end piece of the carrier substrate then forms the channel structure and a second end piece of the carrier substrate is connected to the first end piece, for example by a bonding agent layer between the second main surface of the carrier substrate and the first main surface of the carrier substrate, with the first end piece, so that the channel region is completely separated from is surrounded by the carrier substrate.

According to further exemplary embodiments, the carrier substrate can also be rolled in order to produce a channel (the channel region) for the fluidics, on whose wall (formed by the carrier substrate) the functional elements lie or are arranged.

According to further embodiments, the channel structure may also be formed of a different material than the carrier substrate and may be connected to the carrier substrate during manufacture. For example, flexibility of the carrier substrate may be increased over flexibility of the channel structure, for example to achieve increased stability of the microfluidic module.

Brief Description

Embodiments of the present invention will be explained below with reference to the accompanying figures. Show it:

1 a cross-sectional view of a microfluidic module according to an embodiment of the present invention;

2a - 2c Cross-sectional views of various microfluidic modules according to embodiments of the present invention;

3 a cross-sectional view of a microfluidic module according to another embodiment of the present invention;

4 a diagram illustrating a photocurrent, depending on, located in a channel region of a microfluidic module according to an embodiment of the present invention, fluids;

5 a flowchart of a method for producing a microfluidic module according to an embodiment of the present invention;

6a . 6b Cross-sectional views, as in the manufacture of a microfluidic module according to an embodiment of the present invention, using the manufacturing method according to 5 , may occur; and

7a -D different examples for interfolding a carrier substrate in the manufacture of a microfluidic module according to an embodiment of the present invention.

Detailed description of embodiments of the present invention

Before describing embodiments of the present invention in detail below with reference to the attached figures, it is pointed out that identical elements or elements having the same function are given the same reference numerals and a repeated description of these elements is omitted. Descriptions of elements with the same reference numerals are therefore interchangeable.

1 shows a cross-sectional view of a microfluidic module 100 according to an embodiment of the present invention. The microfluidic module 100 has a one-piece carrier substrate 101 with a first main surface 103 and an opposite second major surface 105 on. Furthermore, the microfluidic module 100 a sensor arrangement 107 on. A first functional element 109 the sensor arrangement 107 is at a first surface area 111 of the carrier substrate 101 arranged. Furthermore, the microfluidic module 100 a channel structure 113 on that with the first main surface 103 of the carrier substrate 101 connected is. Between the first surface area 111 of the carrier substrate 101 and one, the first surface area 111 opposite second surface area 115 of the carrier substrate 101 is a channel area 117 formed by the channel structure 113 and the carrier substrate 101 is surrounded.

The channel area 117 For example, it can be used to hold a fluid, which with the aid of the microfluidic module 100 to be analyzed. The sensor arrangement 107 may be configured to be in the channel area 117 located fluid, using the first functional element 109 analyze. The first functional element 109 For example, it may be a radiation source configured to emit radiation (eg, electromagnetic radiation or optical radiation - for example, in a range from infrared light to ultraviolet light) such that it emits emitted radiation from that in the channel region 117 fluid is reflected and / or absorbed and / or broken and / or otherwise altered. This change can be made, for example, by a further functional element of the sensor arrangement 107 be detected so as to be in the channel area 117 be able to analyze the fluid.

The carrier substrate 101 may be in the range of the sensor arrangement 107 for from the sensor assembly 107 emitted and / or absorbed radiation to be at least partially transparent.

The channel structure 113 may, for example, integral with the carrier substrate 101 be executed. The carrier substrate 101 Therefore, for example, only one connection area 119 between the first main surface 103 of the carrier substrate 101 and a first main surface 121 the channel structure 113 , For example, by means of a primer layer with the channel structure 113 be connected. An advantage of the execution of the channel structure 113 integral with the carrier substrate 101 is that a primer layer between the first major surface 121 the channel structure 113 and the first main surface 103 of the carrier substrate 101 is sufficient to the channel area 117 to form which of the carrier substrate 101 and the channel structure 113 is surrounded. As already explained in the introductory part of this application, the channel structure 113 in a manufacturing process of the microfluidic module 100 by structuring the carrier substrate 101 be formed. The channel area 117 can by folding (for example, starting from an undeformed rectilinear carrier substrate 101 ) of the carrier substrate 101 on the first main surface 121 the channel structure 113 be generated. The carrier substrate 101 therefore, a first carrier substrate portion 123 , For example, on an upper side of the microfluidic module 100 and a parallel extending opposite second carrier substrate portion 125 , For example, on a bottom of the microfluidic module 100 , exhibit. The first carrier substrate portion 123 and the second carrier substrate portion 125 may be over a third carrier substrate portion 127 (or a connection section 127 ), which, for example, as a "curved section" from the top of the microfluidic module 100 to the bottom of the microfluidic module 100 leads, be interconnected. The channel area 117 may therefore be between the first carrier substrate portion 123 and the opposite second carrier substrate portion 125 and between the channel structure 113 (For example, between a side surface of a channel structure element of the channel structure 113 ) and the third carrier substrate portion 127 be educated.

In the in 1 embodiment shown has the channel structure 113 only one channel structure element, however, according to further embodiments, the channel structure 113 also have at least one further channel structure element which, for example, between the channel region 117 and the third carrier substrate portion 127 is arranged. The use of a plurality of channel structure elements can serve, for example, for stability of the microfluidic module 100 to increase. The individual channel structure elements can also be integral with the carrier substrate 101 be executed.

According to further embodiments, the carrier substrate 101 and the channel structure 113 present separately in the preparation. So can the channel structure 113 for example, of a different material than the carrier substrate 101 be formed. For example, the channel structure 113 a lower flexibility than the carrier substrate 101 have increased stability of the microfluidic module 100 at least in the canal area 117 to ensure. For example, a minimum bending radius of the carrier substrate 101 (At least in the region of the third carrier substrate portion 127 ) may be smaller by a predetermined factor than a minimum bend radius of the channel structure. The predetermined factor may, for example, be greater than or equal to 2, 5, 10 or even greater than 20

The channel structure 113 Therefore, in addition to the primer layer between the first major surface 103 of the carrier substrate 101 and the first main surface 121 the channel structure 113 , a further primer layer between the first major surface 103 of the carrier substrate 101 and a second, the first major surface 121 opposite main surface 129 the channel structure 113 , have a further adhesion promoter layer.

How out 1 As can be seen, the first surface area 111 and the second surface area 115 opposite portions of the carrier substrate 101 (or the second main surface 105 of the carrier substrate 101 ) be. The first functional element 109 can therefore be on the second main surface 105 of the carrier substrate 101 be arranged or in other words, the first functional element 109 the sensor arrangement 107 on the second main surface 105 of the carrier substrate 101 be arranged. The carrier substrate 101 Therefore, for example, at the same time a carrier substrate for the first functional element 109 form. Furthermore, the carrier substrate 101 at least in a region of the first functional element 109 if the first functional element 109 a radiation receiver or a radiation detector, for one of the first functional element 109 be emitted or absorbed radiation permeable. For example, the carrier substrate 101 be a transparent film substrate. Thus, the carrier substrate 101 For example, in the visible completely transparent materials such as polyethylene naphthalate, polyethylene terephthalate and / or polycarbonate or consist of at least one of these materials.

The one-piece carrier substrate 101 For example, a foil substrate with a minimum bending radius of less than 200 μm, less than 500 μm or less than 1 mm may be used. The bending radius to be understood in the present application, a lying on an outer radius of a bent part after bending. Therefore, in embodiments, a minimum bend radius may be at least equal to a thickness of the carrier substrate. The minimum bending radius refers to the bending radius of the bent part up to which cracking and cross-sectional change of the bent part in the bending zone does not occur (or only insignificantly low)

The one-piece carrier substrate 101 may for example comprise at least one polymer material. Examples of such polymer materials are: polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polymethylmethacrylate, polystyrene, cycloolefin copolymer, polyetheretherketone or polyamide.

The channel structure 113 may for example comprise at least one polymer material. Examples of such polymer materials are: polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polymethylmethacrylate, polystyrene, cycloolefin copolymer, polyetheretherketone or polyamide.

According to some embodiments, the third carrier substrate portion 127 a higher flexibility than the first carrier substrate portion 123 and the second carrier substrate portion 125 exhibit.

For example, a minimum bending radius of the third carrier substrate portion 127 be smaller by a predetermined factor than a minimum bending radius of the first carrier substrate portion 123 and / or the second carrier substrate portion 125 , The predetermined factor may, for example, be greater than or equal to 2, 5, 10 or even 20.

To the increased flexibility of the third carrier substrate section 127 can reach the third carrier substrate section 127 for example, a smaller thickness than the first carrier substrate portion 123 and / or the second carrier substrate portion 125 exhibit. For example, in the manufacture of the microfluidic module 100 in the region of the third carrier substrate portion 127 less material is applied than in the region of the first carrier substrate portion 123 and / or in the region of the second carrier substrate portion 125 , Furthermore, however, the third carrier substrate section can also be used 127 be subsequently structured, for example by laser cutting, punching or milling. Furthermore, also the complete carrier substrate 101 be manufactured by injection molding, wherein the injection mold is configured such that the third carrier substrate portion 127 a smaller thickness than the first carrier substrate portion 123 and / or the second carrier substrate portion 125 having. As the carrier substrate 101 is integrally formed, a material used for the first carrier substrate portion 123 , the second carrier substrate portion 125 and the third carrier substrate portion 127 be selected identically, and these three carrier substrate sections 123 . 125 . 127 can in the production of the microfluidic module 100 be produced at the same time.

Integral in the context of the present application is intended to mean that the carrier substrate sections 123 . 125 . 127 of the carrier substrate 101 are firmly connected to each other (for example, the carrier substrate sections 123 . 125 . 127 Components of a continuous material layer of the carrier substrate 101 ) and directly adjacent to each other (for example, without an intermediate material). The one-piece carrier substrate 101 may therefore consist of or comprise a continuous or continuous carrier substrate material.

It should be noted that although the carrier substrate 101 , in the sense of the fixed connection of the carrier substrate sections 123 . 125 . 127 is one piece, it can also have several, for example, one above the other molded film layers. Furthermore, a material thickness of the carrier substrate can also be used 101 different in the carrier substrate sections 123 . 125 . 127 of the carrier substrate 101 be. For example, only part of the film layers of the carrier substrate 101 continuously along the carrier substrate sections 123 . 125 . 127 be formed while another part of the film layers of the carrier substrate 101 along a carrier substrate portion (eg, along the first carrier substrate portion 123 or along the second carrier substrate portion 125 ) of the carrier substrate 101 is trained.

According to further embodiments, the first functional element 109 the sensor arrangement 107 also in the carrier substrate 101 be encapsulated, leaving the first surface area 111 a machining surface area of the supporting substrate 101 which forms, for example, in a production of the microfluidic module 100 freilag, and on which the first functional element 109 was prepared and which in a further step, for example by an additional material layer of the carrier substrate 101 was covered. In other words, the sensor arrangement 107 also in the carrier substrate 101 be arranged. Connection contacts of the sensor arrangement 107 can, for example via lines or printed conductors, from the carrier substrate 101 outwardly to an outer substrate surface or side regions of the microfluidic module 300 be guided.

The following are based on the 2a - 2c Further embodiments of the present invention will be explained, which differ from each other by different sensor arrangements and from the in 1 shown microfluidic module 100 distinguished:
2a shows a cross-sectional view of a microfluidic module 200a according to another embodiment of the present invention. The microfluidic module 200a is different from the one in 1 shown microfluidic module 100 in that there is a sensor array 207a which has a first functional element 209a and a second functional element 210a having. The first functional element 209a the sensor arrangement 207a is at the first surface area 111 of the carrier substrate 101 arranged and the second functional element 210a the sensor arrangement 207a is at the second surface area 115 of the carrier substrate 101 arranged. In the in 2a exemplarily shown form, as already in the in 1 shown by way of example, the two surface areas 111 . 115 Sections of the second main surface 105 of the carrier substrate 101 , The first functional element 209a the sensor arrangement 207a and the second functional element 210a the sensor arrangement 207a are therefore on the second main surface 115 of the carrier substrate 101 arranged. The carrier substrate 101 therefore forms a substrate for the first functional element 209a and the second functional element 210a , How out 2a can be seen, the two functional elements 209a . 210a arranged opposite each other so that the channel area 117 yourself between the two functional elements 209 . 210a located.

The first functional element 209a For example, a radiation source 209a be and the second functional element 210a For example, a radiation detector 210a be. A radiation-emitting surface 212a the radiation source 209a is the channel area 117 facing. Furthermore, a radiation-sensitive surface 214a of the radiation detector 210a the channel area 117 facing. The radiation-emitting surface 212a the radiation source 209a is thus opposite to the radiation-sensitive surface 214a of the radiation detector 210a arranged. One from the radiation source 209a , or from the radiation-emitting surface 212a the radiation source 209a , emitted radiation may therefore be the channel region 117 traverse to the radiation-sensitive surface 214a of the radiation detector 210a hold true. The transmission of the radiation through the channel area 117 allows an analysis of one in the channel area 117 located fluid. So can the sensor arrangement 207a For example, for the analysis of luminescence emission, such as fluorescence emission or phosphorescence emission, light scattering, refraction, Absorption, chemiluminescence emission, transmission (which in 2a shown arrangement of the sensor arrangement 207a is especially suitable for measuring transmission).

Under fluorescent emission, the short-term, spontaneous emission of light in the transition of an excited system (for example, atoms or molecules in the channel region 117 located fluid) in a state of lower energy. The atoms or molecules of the in the channel area 117 located fluid can, for example, by, from the radiation source 209a emitted radiation are excited.

Under light scattering is the deflection of light (for example, from radiation source 209a emitted) by interaction with a local other object (for example, in the channel region 117 fluid or one of its components) understood.

By refraction, the change of direction of a wave (for example, that of the radiation source 209a emitted radiation) by changing speed in different media (for example, in the channel area 117 understood fluid) understood

The carrier substrate 101 can, at least in the area of the radiation-emitting surface 212a the radiation source 209a and in the region of the radiation-sensitive surface 214a of the radiation detector 210a for which from the radiation source 209a be emitted radiation, such that the radiation from the source 209a emitted radiation (at least partially) first the carrier substrate 101 penetrates, then the channel area 117 and thus one in the channel area 117 traverses fluid, and then again the carrier substrate 101 traverses to the radiation-sensitive surface 214a of the radiation detector 210a hold true.

The radiation source 209a For example, it may be a light source which is designed to emit radiation, for example in a wavelength range from infrared light to ultraviolet light (for example in a wavelength range from 380 nm to 800 nm). The radiation detector 210a For example, a photodetector (or image detector), for example in the form of an image sensor, for example a CMOS image sensor (CMOS complementary metal oxide semiconductor, complementary metal oxide semiconductor) or a CCD image sensor (CCD charge-coupled Device, charge-coupled device) or in the form of one or more radiation-sensitive transistors or diodes, which is designed to be dependent on the radiation-sensitive surface 214a The photodetector incident radiation to generate one or more photocurrents and vary. Thus, for example, with constant light output of the light source (ie the radiation source 209a ) differently colored fluids or liquids in the channel area 117 via resulting different photocurrents in the photodetector (or in the radiation detector 210a ) be detected.

The light source (or the radiation source 209a ) and the light detector (or the radiation detector 210a ) may be produced on the common carrier substrate during manufacture 101 and, in particular, from one and the same side, although they are, as in 2a shown in the finished microfluidic module 200a are arranged opposite to each other. In other words, the carrier substrate forms 101 a common substrate for the light source, so the radiation source 209a and the light detector, so the radiation detector 210a ,

The light source can be, for example, an organic light-emitting diode or an electroluminescent component which can be produced completely by screen printing. Furthermore, the light detector may be a semiconductor device having a semiconductive layer. A surface of the semiconductive layer of the semiconductor component forms the radiation-sensitive surface 214a in such a way that a photocurrent is variable between an output terminal and an input terminal of the semiconductor component as a function of radiation incident on the semiconductive layer of the semiconductor component. The light detector may be, for example, an organic transistor, but also an organic photodiode. The semiconducting layer of the semiconductor component may comprise, for example as semiconductor material, an organic semiconducting material, such as, for example, pentacenes.

Organic semiconductor elements have the advantage that they can be manufactured over a large area at lower cost than silicon-based semiconductor elements and can therefore be adapted cost-effectively to the typical dimensions of microfluidic channels (for example with channel widths in the range 0.1-10 mm).

2 B shows a cross-sectional view of a microfluidic module 200b according to another embodiment of the present invention. The microfluidic module 200b is different from the one in 1 shown microfluidic module 100 in that a sensor arrangement 207b of the microfluidic module 200b a first functional element 209b and a second functional element 210b having. The first functional element 209b as well as the second functional element 210b the sensor arrangement 207b are at the first surface area 111 of the carrier substrate 101 arranged.

The first functional element 209b For example, a radiation source 209b with a radiation-emitting surface 212b be. The radiation source 209b may be similar or identical to the radiation source described above 209a be. Furthermore, the second functional element 210b a radiation detector 210b with a radiation-sensitive surface 214b be. The radiation detector 210b may be similar or identical to the one in 2a described radiation detector 210a be. Both the radiation-emitting surface 212b the radiation source 209b as well as the radiation-sensitive surface 214b of the radiation detector 210b are the channel area 117 facing. It should be noted that the arrangement of the functional elements 209b . 210b the sensor arrangement 207b itself from the arrangement of the functional elements 209a . 210a the sensor arrangement 207a as they are based on 2a has been described, thereby distinguishing that the two functional elements 209b . 210b the sensor arrangement 207b are not arranged opposite to each other, but in the same common first surface area 111 of the carrier substrate 101 are arranged side by side. The radiation source 209b and the radiation detector 210b are arranged such that one of the radiation source 209b emitted radiation from one in the channel region 117 located fluid is at least partially reflected or scattered or emitted in the channel, on the radiation-sensitive surface 214b of the radiation detector 210b meets. In other words, the concept of the microfluidic module differs 200b from the concept of the microfluidic module 200a in that the radiation which does not detect the channel region is detected 117 completely but only the radiation reflected or scattered or emitted by the fluid from the radiation detector 210b is detected. This allows opposite to in 2a shown concept further analysis options in the channel area 117 located fluids. The radiation source 209b For example, it may be formed as a light source, as previously described in connection with the microfluidic module 200a has been described, and the radiation detector 210b For example, it can be designed as a light detector, as it has already been described above with reference to the microfluidic module 200a has been described. A re-description of this light source and this light detector is therefore omitted.

Of course, a combination of in 2a shown concept and the in 2 B For example, another optional radiation detector can be used 230 with a radiation-sensitive surface 232 at the second surface area 115 of the carrier substrate 101 be arranged to both the transmission behavior and the reflection behavior and fluorescence in the channel region 117 be able to analyze existing fluids. By analyzing both the transmission and reflection behaviors of the channel region 117 located fluids can be a more detailed statement about the in the channel area 117 meet located fluids.

2c shows a cross-sectional view of a microfluidic module 200c according to another embodiment of the present invention. The microfluidic module 200c extends that into 2 B shown microfluidic module 200b Going to that a sensor arrangement 207c of the microfluidic module 200c in addition to the first functional element 209b and the second functional element 210b a third functional element 216 which is at the second surface area 115 of the carrier substrate 101 is arranged. The third functional element 216 For example, a reflection element 216 which is adapted to be from the radiation source 209b to reflect emitted radiation, so that this on the radiation-sensitive surface 214b of the radiation detector 210b meets. The reflection element 216 can do this with a reflective surface 218 which are the channel area 117 is facing. From the radiation source 209b emitted radiation therefore traverses the channel region 117 and in the channel area 117 fluid on the reflective surface 218 of the reflection element 216 hold true. The emitted radiation is at the reflecting surface 218 of the reflection element 216 at least partially reflected to again traverse the channel region and the fluid in the channel region to access the radiation-sensitive surface 214b of the radiation detector 210b hold true. In other words, crosses, where in 2c shown concept, at least that of the reflective surface 218 of the reflection element 216 reflected part of the radiation source 209b emitted radiation, the channel area 117 (and thus one in the channel area 117 fluid) twice before it hits the radiation-sensitive surface 214b of the radiation detector 210b meets. In addition, as with the in 2 B shown concept, a part of the radiation are already detected by that in the channel area 117 fluid is reflected.

The reflection element 216 can be easily realized, for example, by a metallization layer, which in a production on the second main surface of the carrier substrate 101 can be evaporated and the reflective surface 218 of the reflection element 216 forms.

In the following, various further embodiments of embodiments of the present invention will be explained with reference to a detailed embodiment. The in the past by means of 1 such as 2a - 2c described embodiments can be extended at least to a part of, described below with reference to the detailed embodiment, features.

3 shows a microfluidic module 300 according to another embodiment of the present invention. This in 3 shown microfluidic module 300 is different from the one in 2a shown microfluidic module 200a in that a channel structure of the microfluidic module 300 a first channel structure element 313a and a second channel structure element 313b having. A channel structure may also be generally referred to as a fluidic substrate. As a fluidic substrate, for example, the initially mentioned film stacks can be used which already have an adhesive layer. The channel structure elements 313a . 313b are arranged so that the channel area 117 between a first side surface 320a the first channel structure element 313a and an opposite first side surface 320b of the second channel structure element 313b and between the first surface area 111 of the carrier substrate 101 and the second surface area 115 of the carrier substrate 101 is trained. The two channel structure elements 313a . 313b thus limit the channel area 117 laterally.

The channel area 117 can also be used as a channel 117 be designated.

In other words, the channel area becomes 117 through the side surfaces 320a . 320b the channel structure elements 313a . 313b as well as through the carrier substrate 101 (more precisely through the first main surface 103 of the carrier substrate 101 ) limited. A first main surface 329a and an opposite second major surface 321a the first channel structure element 313a as well as a first main surface 329b and an opposite major surface 321b of the second channel structure element 313b are each by means of a primer layer with the first major surface 103 the channel structure 101 connected. The main surfaces 329a . 329b . 321a . 321b the channel structure elements 313a . 313b For example, by means of a bond with the first main surface 103 of the carrier substrate 101 be connected.

This is shown by the channel structure of the microfluidic module 300d for example, the two through the channel area 117 separate channel structure elements 313a . 313b on, with the two channel structure elements 313a . 313b are arranged so that the channel area 117 between the first page surface 320a the first channel structure element 313a and the first page surface 320b of the second channel structure element 313b and between the two opposing carrier substrate sections 123 . 125 is trained. The two opposite carrier substrate sections 123 . 125 of the carrier substrate 101 are over the third carrier substrate portion 127 (ie via a connecting section) connected to each other.

A material of the channel structure of the microfluidic module 300 , So a material of the channel structure elements 313a . 313b may have less flexibility than a material of the carrier substrate 101 exhibit. This allows greater stability of the microfluidic module 300 be achieved.

As with the in 2a shown microfluidic module 200a also has the microfluidic module 300 a sensor arrangement 307 on, in which a first functional element 309 at the first surface area 111 of the carrier substrate 101 is arranged and a second functional element 310 at the second surface area 115 of the carrier substrate 101 is arranged.

Furthermore, the functional elements 309 . 310 the sensor arrangement 307 wider in its lateral extent than the channel area 117 such that at least a right and a left edge region of the functional elements 309 . 310 above or below an edge region of the channel structure elements 313a . 313b are arranged. This makes it possible to achieve that despite a high flexibility of the carrier substrate 101 , and despite the additional arrangement of the functional elements 309 . 310 the sensor arrangement 307 on or in the carrier substrate 101 , the carrier substrate 101 at the location of the functional elements 309 . 310 is not compressed, leaving a geometry of the channel structure 117 preserves and a distance between the two functional elements 309 . 310 the sensor arrangement 307 remains constant.

Furthermore, in the in 3 shown microfluidic module 300 the first functional element 309 the sensor arrangement 307 an electroluminescent device 309 , which can be produced, for example, completely, by screen printing. Furthermore, the second functional element 310 the sensor arrangement 307 an organic field effect transistor 310 which has a radiation-sensitive organic semiconducting layer.

In order to obtain high light detection efficiency, a control electrode of the organic field effect transistor may be provided 310 be transparent. This can be achieved by using indium tin oxide (ITO) as gate electrode (or gate electrode material or Control electrode material). This can in a structure to the carrier substrate 101 (and thus to the channel area 117 ) are oriented (so-called bottom gate geometry or bottom gate structure, "bottom gate" - underlying control electrode) through which the radiation to be detected on the organic Feldeffektransistor 310 incident. In other words, the organic field effect transistor 310 a transparent control electrode between its radiation-sensitive, organic, semiconductive layer and the carrier substrate 101 exhibit. An alternative to ITO as a material for the gate electrode is ATO (antimony tin oxide).

Furthermore, even when using another organic semiconductor device as a second functional element 310 , such as an organic photodiode, one to the carrier substrate 101 (and thus to the channel area 117 ) facing electrode of the organic semiconductor device can be selected transparent.

According to further embodiments, the second functional element 310 also be an inorganic transistor (for example silicon-based) with a radiation-sensitive inorganic semiconducting layer.

Furthermore, the carrier substrate 101 of the microfluidic module 300 be a film substrate. That is, the carrier substrate 101 can be both flexible and transparent. The film substrate may, for example, comprise at least one polymer material. Examples of such polymer materials are: polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polymethylmethacrylate, polystyrene, cycloolefin copolymer, polyetheretherketone or polyamide.

3 shows therefore a structure for an analysis system that can be made entirely from plastic substrates or plastic substrates with conventional cheap processes. This structure can be produced to a large extent by inexpensive and thus favorable printing, liquid application and / or structuring processes.

In other words shows 3 a cross-section through an example system, which optically absorbs a liquid in a fluidic channel (in the channel region 117 ) analyzed. Such systems can be used in medical diagnostics, for example for the detection of pathogens in patient samples (blood, serum, saliva, urine, etc.), for example by means of bioassays, which leads to a color change of the liquid (or the fluid) in the channel (in the channel region 117 ) to lead.

A bioassay is a procedure for determining the concentration, purity and / or biological activity of a substance (eg vitamins, hormones, growth factors, antibiotics, enzymes) by measuring its effect on organisms, tissues, cells, enzymes or other (bio) chemical receptors.

The channel area 117 For example, it may have an inlet opening and an outlet opening for introducing a suitable sample into the channel area 117 to give. Both the inlet opening and the outlet opening of the channel area 117 may be closable, for example by means of a suitable closure. This in 3 shown microfluidic module 300 Therefore, for example, it can be used as a reusable product. For this purpose, first the entrance opening of the channel area 117 be opened to a suitable sample in the channel area 117 to give. This sample can be detected by means of the sensor arrangement 307 be analyzed and then via the exit port of the channel area 117 be removed. The inlet opening and the outlet opening of the channel area 117 may even be identical in this case. Furthermore, the channel area 117 but also have separate inlet and outlet openings, for example, a continuous liquid through the channel area 117 analyze. Use as a reusable product allows various assays to be performed on, for example, a patient sample (such as blood or saliva or urine) with various added reagents, for example, to test the patient sample for various pathogens.

According to further embodiments, the microfluidic module 300 but also be designed as a disposable product. The channel area 117 For example, this may be a closed channel region in which the patient sample is introduced with a suitable septum. The channel area 117 For example, it may already have a test reagent that mixes with the patient sample to perform certain analyzes of the patient sample. In other words, already in the production of the microfluidic module 300 a test reagent in the channel area 117 of the microfluidic module 300 are given.

An analysis of the in the channel area 117 The present sample can, for example, be contacted via externally contactable printed conductors or contacts of the sensor device 307 respectively. About the externally accessible contacts, for example, a supply voltage for the electroluminescent component 309 and the organic field effect transistor 310 be supplied, at the same time can be guided over the outwardly guided contacts in the organic field effect transistor 310 resulting photocurrent can be measured. The measured photocurrent forms a result of the analysis of the in the channel region 117 located fluid, which can be evaluated by suitable methods.

Further fields of application of exemplary embodiments of the present invention are, in addition to medical diagnostics, for example environmental analysis, veterinary medicine, or security (security) and forensics. By means of slight modifications of the construction shown, it is possible to realize systems for the analysis of fluorescence emission, chemiluminescence emission, light scattering, refraction, transmission, absorption.

So can the sensor arrangement 307 for example, one in the channel area 117 fluid with regard to fluorescence, reflection, refraction, scattering, absorption, coloring and / or transmission behavior or a subset of the mentioned analyze.

So can the sensor arrangement 307 For example, additional functional elements on the second surface area 115 of the carrier substrate 101 exhibit. For example, a plurality of organic field-effect transistors or generally a plurality of light detectors are conceivable, wherein different light detectors are equipped with different spectral filters to color in the channel region 117 to be able to analyze the fluid present. Furthermore, the sensor arrangement 307 also a plurality of over the second surface area 115 have distributed light detectors, for example, a refraction or scattering by that in the channel region 117 to be able to analyze the present fluid. For example, different photocurrents from at different positions of the second surface area 115 arranged light detectors are detected and analyzed.

Furthermore, the sensor arrangement 307 also on the first surface area 111 a plurality of radiation sources, for example, different spectral regions having.

This in 3 shown system consists inter alia of the fluidic plastic or plastic (other materials are of course also possible) of a certain thickness (for example, 10 microns to 5000 microns), in which a cut is cut, which serves as a channel in the overall system. This can be produced with different structuring techniques, eg. As laser cutting, punching, milling, and / or production by injection molding, etc. Typical channel widths for the channel area 117 For example, 10 microns to 10,000 microns.

On additional polymer substrates (on the carrier substrate 101 ) become planar functional elements (for example the electroluminescent component 309 and the organic field effect transistor 310 ) applied. They serve the light generation and detection. They are combined with the fluidic substrate (with the channel structure, ie with the first channel structure element 313a and the second channel structure element 313b ) by gluing (for example via an adhesive interlayer, solvent gluing, thermal welding of the two substrates, laser welding and / or plasma bonding, etc.).

In 3 is as a light source or radiation source, the electroluminescent component 309 represented, for example, which can be produced completely by screen printing. Alternatively, organic light emitting diodes (OLED) could be used. As a detection element (as a radiation detector or light detector) is here a planar transistor (the organic field effect transistor 310 ). This can be produced using organic semiconductors and dielectrics in a combination of solution-based deposition and printing processes. Alternatively, a photodiode made of organic materials could be used.

conductor tracks 322 of the microfluidic module 300 can be prepared by means of printable or dispensable conductive polymers or by metal deposition (sputtering, on-ramp, CVD - Chemical Vapor Deposition - Chemical Vapor Deposition, PVD - Phyiscal Vapor Deposition) and structuring (photolithography and etching, shadow masks) be generated. As in 3 can show the tracks 322 along the third carrier substrate portion 127 of the carrier substrate 101 at the second main surface 105 of the carrier substrate 101 be arranged. So can the tracks 322 For example, all connections of the sensor array 307 (The connections of the Elektroluminiszenzbauteils 309 and the organic field effect transistor 310 ) on the same side of the microfluidic module 300 lead, so that these from the same side of the microfluidic module 300 are accessible.

This in 3 shown microfluidic module 300 works as follows. At constant light output of the light source (the electroluminescent component 309 ) are different colored liquids or fluids in the channel (in the channel area 317 ) via resulting different photocurrents in the phototransistor (in the organic field effect transistor 310 ).

4 shows in a diagram by way of example the current of the transistor between source (ie between a source terminal) and drain (ie a drain port) depending on various fluids in the channel, where K1-K4 denotes times at which a liquid having different concentrations of an absorbing molecule in the channel (in the channel region 117 ). Different concentrations result in distinguishable transistor currents (distinguishable photocurrents between an input terminal and an output terminal of the organic field effect transistor 310 ).

At the in 4 the diagram shown is plotted on an abscissa the time in seconds. A resulting photocurrent of the organic field effect transistor 310 I _drain is plotted on the ordinate of the graph in amperes. The resulting photocurrent I _drain for the respective liquid in the channel region 117 forms a signature of the liquid, which is used for analysis.

Since light generation and light detection element (the electroluminescent device 309 and the organic field effect transistor 310 ) are electrically driven and read out, embodiments of the present invention provide a configuration which facilitates the emission of light through the substrate (the carrier substrate 101 ) or the detection by the substrate (by the carrier substrate 101 ) allowed. In embodiments of the present invention, this may be done by means of transparent electrodes of the elements on the substrate side (the functional elements 309 . 310 the sensor arrangement 307 , ie the electroluminescent component 309 and the organic field effect transistor 310 on the second main surface 105 of the carrier substrate 101 ) can be achieved. Furthermore, an arrangement of the functional elements 309 . 310 the sensor arrangement 307 at the first main surface (ie within the channel area 117 ) usable. However, precautions may be needed to the functional elements 309 . 310 the sensor arrangement 307 before in the canal area 117 to protect the fluid.

Organic materials tend to be very sensitive to moisture but, in embodiments of the present invention, are located near a fluid-carrying channel (near the channel region 117 ) used. Moisture can also diffuse relatively quickly through the substrate materials and can be used primarily in the detection element (that is, for example, in the organic field-effect transistor 310 ) lead to moisture-induced leakage currents.

In order to avoid or minimize these moisture-related leakage currents, two approaches have been found. On the one hand, the substrate of the functional elements (the carrier substrate 101 ) on one of its sides (for example, on the first main surface 103 or the second major surface 105 ) are coated with a layer which inhibits the diffusion of moisture.

Such layers mostly comprise (or consist of) a combination of metallic, oxidic and / or organic multilayers and may be well known. However, these layers can not completely suppress water diffusion (or generally liquid diffusion) and thus only delay but not prevent the occurrence of leakage currents.

Another alternative found depends on the detection method used.

This is below with reference to the right side of the in 6a illustrated illustration of the functional film will be explained, which schematically represents a transistor. A transistor as may be used in embodiments of the present invention generally includes an input terminal, such as a source or collector terminal, an output terminal, such as a drain or emitter terminal, and a control terminal, such as a gate or base terminal.

The in 6a exemplified transistor 310 is a field effect transistor, of course, a use of another transistor technology (such as bipolar technology) is possible.

The transistor 310 forms a radiation detector of a microfluidic module according to an embodiment of the present invention. Measured here is the current between source 613 (German: source electrode, which is connected for example to an input terminal of the transistor) and drain 614 (German: drain electrode, which is connected for example to an output terminal of the transistor), ie between the two source-drain contacts 613 . 614 while at gate or gate electrode 609 (German: control electrode, which, for example, with a control terminal of the transistor 310 connected), which in 6a Also referred to as an ITO gate (ITO - indium tin oxide, an exemplary material for the gate electrode, for example, to make the gate electrode transparent), a certain voltage is applied. The voltage at the control electrode 609 can basically be chosen arbitrarily, but it influences the sensitivity of the detection. Increasing moisture is mainly reflected in an increasing conductivity of the dielectric and leads to a current between the source 613 and gate 609 or drain 614 and gate 609 (depending on how the corresponding potentials are chosen), ie between one Input terminal of the transistor and a control terminal of the transistor 310 or an output terminal of the transistor and the control terminal of the transistor. Either source 613 or drain 614 , So either the input terminal or the output terminal of the transistor 310 , are normally grounded (at a reference potential), the other contact (which is not at the reference potential) can be placed either at a positive or negative potential (depending on the polarity of the charge carriers in the semiconductor). Is this (positive or negative) potential selected identically to the potential of the gate electrode 609 , So to the potential of the control electrode 609 , no leakage current can flow between these two electrodes (with the same potential).

In other words, the control terminal of the transistor can be electrically conductive (for example via interconnects) to the input terminal or to the output terminal of the transistor 310 be connected, such that no leakage current (via a wet dielectric) between the two electrically conductive interconnected terminals of the transistor 310 can flow. The measurement of the photoinduced current thus becomes independent of the influence of humidity or other factors such as the aging of the phototransistor.

According to further embodiments, a potential (for example a voltage) may also be present at the control terminal of the transistor 310 within a tolerance range equal to a potential (eg, a voltage) at the input terminal of the transistor 310 may be selected, or deviate by a maximum of 1%, 5%, 10%, 20% or 50% such that no (or only insignificantly low) leakage current exists between the control terminal of the transistor 310 and the input terminal of the transistor 310 can flow. For example, the tolerance range may be less than or equal to 1%, less than or equal to 5%, less than or equal to 10%, less than or equal to 20%, or less than or equal to 50% of one between the input terminal and the output terminal of the transistor 310 applied voltage (for example, a source-drain voltage) or an operating or rated voltage of the transistor 310 to get voted. The output terminal of the transistor 310 can be set to reference potential, so that the leakage current can flow through this. The potentials at the control terminal and at the input terminal may, for example, be provided by a common voltage source or two different voltage sources.

According to further embodiments, a potential (for example a voltage) may also be present at the control terminal of the transistor 310 within a tolerance range equal to a potential (eg, a voltage) at the output terminal of the transistor 310 be selected, or by a maximum of 5%, 10% or 20%, such that no (or only insignificantly low) leakage current between the control terminal of the transistor 310 and the output terminal of the transistor 310 can flow. For example, the tolerance range may be less than or equal to 1%, less than or equal to 5%, less than or equal to 10%, less than or equal to 20%, or less than or equal to 50% of one between the input terminal and the output terminal of the transistor 310 applied voltage (for example, a source-drain voltage) or an operating or rated voltage of the transistor 310 to get voted. The input terminal of the transistor 310 can be set to reference potential, so that the leakage current can flow through this. The potentials at the control terminal and at the output terminal may, for example, be provided by a common voltage source or two different voltage sources.

The reference potential may be, for example, a ground potential (for example 0 volts), but may also assume any other value. Furthermore, also the connection of the transistor 310 which does not have the same potential as the control terminal, have a positive or negative potential which is different from the reference potential (eg, the ground potential). Furthermore, the potential of the control terminal and the further terminal of the transistor 310 , which has the same potential as the control terminal, be selected equal to the ground potential.

The current flowing in the polarized contact of the source-drain plane (the connection of the source-drain connections, which is connected to the control connection and / or has the same potential) is therefore free of moisture-induced leakage currents and a direct signature of the source between and drain (between the input terminal and the output terminal) flowing current, which depends only on the intrinsic properties of the transistor and the photo-generation of charge carriers (in the semiconductor of the transistor). The moisture-related leakage currents flow via the grounded electrode (via the terminal of the transistor which is connected to the reference potential connection or at the reference potential). This mentioned interconnection can be realized (only) with a transistor as a photodetector or as a radiation detector. With a diode as a photodetector, the moisture-induced leakage current would flow directly through the two single electrodes (through an input terminal and an output terminal of the diode) and cover (at least partially) the signature of the photogenerated charge carriers.

In other words, in some embodiments of the present invention, a radiation detector is a semiconductor device, wherein a surface of a semiconducting layer of the semiconductor device forms a radiation-sensitive surface of the radiation detector, such that a photocurrent between an output terminal and an input terminal of the semiconductor device in response to the semiconducting Layer of the semiconductor device incident radiation is variable.

Furthermore, in at least some embodiments of the present invention, the semiconductor device may be a transistor, wherein a control terminal of the transistor is electrically conductively connected to the output terminal of the transistor and the input terminal of the transistor is connected to a reference potential terminal of the microfluidic module, such that a z. B. flowing through a fluid located in the channel region leakage current flows through the input terminal of the transistor. In further embodiments of the present invention, the control terminal of the transistor may be electrically conductively connected to the input terminal of the transistor, and the output terminal may be connected to the reference potential terminal of the microfluidic module, such that the leakage current produced by the fluid in the channel region is drained via the output terminal.

Since an organic semiconductor band gap usually corresponds to an energy that can be excited by visible light, it has therefore been found that organic semiconductors can be used as a sensor material for radiation detectors in microfluidic modules according to embodiments of the present invention. Applicable here are components such as organic solar cells, photodiodes and organic TFTs (TFT = thin-film transistor, thin-film transistor). Examples of this are ambipolar TFTs, as described, for example, under: http://www3.imperial.ac.uk/people/thomas.anthopoulos or integrated sensors, which are applied from silicon as carrier material, as for example under: http://spie.org/x38725.xml?ArticleID=x38725 to be shown. Furthermore, pentacene-based components (organic components in which the semiconductor material has pentacenes) are also conceivable, which enable the detection of light, as described, for example, in: Solid State Electronics, Volume 51, Issue 7, July 2007, Pages 1052-1055, Yong-Young Noh, Dong-Yu Kim are shown.

Below is a manufacturing method for a microfluidic module according to an embodiment of the present invention with reference to 5 as well as the 6a and 6b be explained in detail.

5 shows a flowchart of a method 500 for producing a microfluidic module. The procedure 500 has a step 501 the provision of a one-piece carrier substrate having a first main surface and an opposite second main surface, wherein a first functional element of a sensor arrangement is arranged on a first surface region of the carrier substrate.

Furthermore, the method 500 one step 502 the provision of a channel structure.

Furthermore, the method 500 one step 503 connecting the channel structure to the first main surface of the carrier substrate, wherein connecting the channel structure to the first main surface of the carrier substrate is such that a channel region is formed between the first surface region of the carrier substrate and a second surface region of the carrier substrate opposite the first surface region; is surrounded by the channel structure and the carrier substrate.

Or in other words, in the step of providing the channel structure, the channel structure can be patterned from the carrier substrate, for example by targeted material removal, for example using different structuring techniques, such as laser cutting, punching, milling. Furthermore, however, the carrier substrate can already be produced in such a way that the channel structure is already molded during the production of the carrier substrate, for example by production by means of injection molding.

The step 501 the provision of the one-piece carrier substrate and the step 502 the provision of the channel structure can take place at the same time, for example if the channel structure is formed integrally with the carrier substrate. In this case, the channel structure can be structured out of the substrate by a structuring process, as described below with reference to FIGS 7b and 7c will be shown.

According to further embodiments, the channel structure and the carrier substrate may also be formed in several pieces, ie. They consist of different pieces, which in the step 503 would be connected to each other, for example by means of suitable adhesive layers.

According to further embodiments, the channel structure and the carrier substrate may also be two separate substrates, which only in the step 503 be joined together, for example by means of several adhesive layers, as for example with reference to Mikrofluidikmoduls 300 according to 3 is shown. For example, the channel structure may comprise a different material than the one-piece carrier substrate. For example, a material of the channel structure may have a lower flexibility than a material of the one-piece carrier substrate, for example to be able to ensure a higher stability of the manufactured microfluidic module in the region of the channel structure.

According to further embodiments, the method 500 before the step 502 providing the channel structure comprises a step of disposing one or more adhesive layers on major surfaces of the channel structure which in step 503 of the procedure 500 be connected to the first main surface of the carrier substrate, and the subsequent structuring of the channel structure. In other words, the adhesive layers can already be applied (for example glued) to the channel structure prior to the subsequent structuring of the channel structure and be structured together with the channel structure. This reduces an adjustment effort and, furthermore, an additional structuring step (the structuring of the adhesive layers) is saved. The adhesive layers can be in the step 503 of the procedure 500 serve to connect the channel structure to the carrier substrate.

According to further embodiments, the method 500 before the step 501 providing the carrier substrate one step 504 arranging the first functional element on the first surface area of the carrier substrate and arranging a second functional element on a second surface area of the carrier substrate. The first surface area and the second surface area belong to a common processing surface of the carrier substrate. A common processing surface in this case means that this surface can be processed or processed from one and the same side, whereby a significant cost advantage can be achieved, in particular in relation to processes in which the carrier substrate is processed from both sides.

According to further embodiments, the method 500 before the step 501 providing the carrier substrate comprises a step of perforating (for example, laser perforating) folding sections of the carrier substrate. The perforations can for example specify a folding or bending region of the carrier substrate. By means of the perforations, the carrier substrate can be folded more easily at the desired location, which ensures that the functional elements of the microfluidic module are arranged precisely opposite one another after folding or folding over.

In other words, in embodiments of the present invention, manufacturing cost reduction is achieved by making first and second functional elements, such as a light-generating and light-detecting element, on the same side of a single substrate (on the common processing surface of the carrier substrate) , This is made possible by compatible manufacturing processes of the two elements (the two functional elements or the light-generating element and the light-detecting element). Such a structure is exemplary in 6a shown.

6a shows a cross-sectional view of an intermediate, as in the manufacture of a microfluidic module according to an embodiment of the present invention using the method 500 can arise for the production of a microfluidic module. This in 6a shown intermediate product has a carrier substrate 101 with a first main surface 103 and an opposite second major surface 105 on. On the first main surface 105 in a first surface area 111 is a first functional element 309 arranged. Furthermore, on the second main surface 105 of the carrier substrate 101 in a second surface area 115 of the carrier substrate 101 a second functional element 310 arranged. The first functional element 309 and the second functional element 310 can be a sensor arrangement 307 form. In the in 6a shown concrete example is the first functional element 309 an electroluminescent device 309 , The second functional element 310 is an organic field effect transistor 310 , This in 6a The intermediate product shown can therefore be an intermediate, as in the preparation of in 3 shown microfluidic module 300 arises. The first surface area 111 and the second surface area 115 belong to a common processing surface of the carrier substrate 101 ie, these two surface areas are from the same side of the carrier substrate 101 editable. This can achieve a significant cost reduction compared to systems in which a carrier substrate is processed from both sides.

The electroluminescent device 309 has a transparent electroluminescent bottom electrode 601 on which on the second main surface 105 of the carrier substrate 101 at the first surface area 111 is arranged. To the transparent electroluminescent bottom electrode 601 a dielectric layer shoots itself 603 which also has a dielectric layer of the organic field-effect transistor 310 can form. Adjacent to the dielectric 603 has the electroluminescent component 309 an electroluminescent phosphor layer 605 on. Adjacent to the electroluminescent phosphor layer 605 has the electroluminescent component 309 an optional mirrored electroluminescent lid electrode 607 on. The use of the electroluminescent component 309 As a functional element or as a radiation source has the advantage that such a Elektrolumineszenzbauteil is completely produced by means of inexpensive screen printing process. The transparent electroluminescent bottom electrode 601 in conjunction with the mirrored electroluminescent lid electrode 607 serve to generate an electric field in response to which the electroluminescent phosphor layer 605 Emitted radiation. As the electroluminescent phosphor layer 605 Radiation emitted in all directions is the cover electrode 607 mirrored to reflect incoming radiation. The bottom electrode 601 is transparent, as is the carrier substrate 101 in the region of the electroluminescent component 309 so that the of the electroluminescent component 309 emitted radiation can penetrate through the substrate into a channel region of the finished microfluidic module.

The organic field effect transistor 310 has a control electrode 609 (referred to in the drawing as ITO gate, ITO = indium tin oxide), which is on the second major surface 105 of the carrier substrate 101 at the second surface area 115 of the carrier substrate 101 is arranged. The control electrode 609 For example, with a control terminal of the organic field effect transistor 310 be connected.

To the control electrode 609 borders the dielectric layer 602 at. Adjacent to the dielectric layer 603 has the organic field effect transistor 310 a semiconductor layer 611 on. The semiconductor layer 611 For example, it may be an organic semiconductor layer, for example of pentacene, and is sensitive to radiation, ie a conductivity of the semiconductor layer 611 is dependent on the semiconductor layer 611 meeting radiation. Adjacent to the semiconductor layer 611 has the organic field effect transistor 310 an input terminal 613 (For example, a source terminal) and an output terminal 614 (For example, a drain connection). As already described, the input terminal 613 or the output port 614 conductive with the control terminal (and thus with the control electrode 609 ) of the organic field effect transistor 310 be connected to z. B. to avoid leakage currents occurring due to moisture diffusion. Generally, the input terminal 613 or the output port 614 a potential which is the same within a tolerance range as the control connection (and thus the control electrode 609 ) of the organic field effect transistor 310 exhibit.

The terminal of the organic field effect transistor not connected to the control terminal 310 can be connected to a reference potential terminal of the microfluidic module.

Like the transparent electroluminescent bottom electrode 601 of the electroluminescent component 309 so can the control electrode 609 of the organic field effect transistor 310 be transparent, such that radiation through this control electrode 609 can penetrate through to the semiconductive layer 611 of the organic field effect transistor 310 hold true. In other words, the control electrode 609 of the organic field effect transistor 609 be transparent, so that the light is undamped on the light-sensitive layer, the organic semiconductor (the semiconductive layer 611 of the organic field effect transistor 310 ). Furthermore, carrier substrate can also be used 101 , as well as the dielectric layer 603 , at least in the region of the organic field effect transistor 310 and the electroluminescent device 309 to be transparent.

In the in 6a The intermediate product shown is the dielectric layer 603 consistently over the entire carrier substrate 101 executed. According to further embodiments, both the electroluminescent component 309 as well as the organic field effect transistor 310 each having its own dielectric layer, which is separated from the dielectric layer of the other functional element.

In the 6a shown layers of the electroluminescent component 309 and the organic field effect transistor 310 can be produced by means of compatible manufacturing processes.

The overall system (ie a microfluidic module according to an exemplary embodiment of the present invention) can be produced by folding over the functional substrate (of the carrier substrate 101 ) getting produced. The folding over can take place in such a way that the first surface area 111 and the second surface area 115 of the carrier substrate 101 after folding over each other, or in other words that the electroluminescent component 309 and the organic field effect transistor 310 are opposite each other.

In other words, at the step 503 connecting the channel structure to the first main surface of the carrier substrate, the carrier substrate are folded over the channel structure such that the first functional element is arranged opposite the second functional element is and at least a part of the channel region is located between the first functional element and the second functional element.

6b indicates the intermediate 6a after folding and connecting the carrier substrate 101 with a channel structure. In the in 6b As shown, the channel structure has a first channel structure element 313a and a second channel structure element 313b on. This in 6b Therefore, the microfluidic module shown can be similar to the one shown in FIG 3 shown microfluidic module 300 being in the figure in 6b additionally layered structures of the electroluminescent component 309 and the organic field effect transistor 310 are shown.

In 6b is the dielectric layer 603 no longer shown throughout, ie the electroluminescent component 309 and the organic field effect transistor 310 have separate dielectric layers. As already explained, in the production of the electroluminescent component 309 and the organic field effect transistor 310 Each functional element to be assigned its own dielectric layer, which is separated from the dielectric layer of the respective other functional element. Furthermore, however, it is also possible for a common dielectric layer to be present on the substrate layer 101 getting produced. This dielectric layer may be prior to folding the carrier substrate 101 For example, in a connecting portion of the carrier substrate 101 be removed by suitable structuring processes.

How out 6b can be seen, the entire system (ie a microfluidic module) by folding the functional substrate (the carrier substrate 101 ) around the fluidic substrate (around the channel structure or channel structure elements) 313a . 313b ) and a bond are made. Furthermore, it is also possible for the fluidic substrate (the channel structure) to be made of the same material as the functional substrates (such as the carrier substrate) 101 ) and then process it simultaneously with them. The end system (a microfluidic module) can then be constructed by folding the individual substrate parts into one another and bonding them to one another.

Below are still briefly at the 7a to 7d four different examples for folding a carrier substrate and its connection with a channel structure for producing a microfluidic module according to an embodiment of the present invention will be described. For simplicity, functional elements arranged on the carrier substrate are not shown in the following drawings. Furthermore, in the in 7a to 7c a channel structure shown in each case two channel structure elements 313a . 313b however, the examples shown are also applicable to any number of channel structure elements. Thus, for example, a realization can be used in which the channel structure has only one channel structure element, as for example with reference to FIG 1 is shown.

7a shows a first possibility of folding a carrier substrate 101 , In the in 7a the example shown, the functional substrate, so the channel structure is separated from the carrier substrate 101 in front. 7a-1 shows the carrier substrate 101 before folding. The carrier substrate 101 has a first carrier substrate portion 123 and a second carrier substrate portion 125 which, via a third carrier substrate portion 127 connected to each other. The third carrier substrate portion 127 therefore forms a connecting portion between the first carrier substrate portion 123 and the second carrier substrate portion 125 ,

Furthermore, the carrier substrate 101 perforations 707 (For example, laser perforations), which can serve as a folding and adjustment help, for example. The perforations may, for example, a fold or bend region of the carrier substrate 101 pretend. The perforations can, as in 7a shown in the region of the connection section 127 be arranged, which for example forms a folding portion of the finished microfluidic module. By means of the perforations, the carrier substrate can be folded more easily at the desired location, which ensures that the functional elements of the microfluidic module are arranged precisely opposite one another after folding or folding over.

7a-2 shows the carrier substrate 101 after folding over and connecting to a channel structure or with two channel structure elements 313a . 313b , The two channel structure elements 313a . 313b be with the carrier substrate 101 , glued for example by means of adhesion promoter layers.

7b shows a further possibility of folding the carrier substrate 101 to obtain a microfluidic module according to an embodiment of the present invention. This in 7b Example shown differs from that in 7a shown example in that the channel structure integral with the carrier substrate 101 is formed.

7b-1 shows the carrier substrate 101 before folding. To form the channel structure, the carrier substrate 101 be structured by means of suitable structuring processes. In 7b-1 are the areas of the carrier substrate 101 which are removed by means of these structuring processes to form the channel structure.

7b-2 shows the carrier substrate 101 after structuring, leaving the two channel structure elements 313a . 313b are formed. In the in 7b-2 The example shown is the channel structure elements 313a . 313b Components of the first carrier substrate portion 323 , According to further embodiments, the two channel structure elements 313a . 313b but also components of the second carrier substrate section 125 be.

According to further embodiments, the step of structuring the channel structure may also be omitted, for example when the carrier substrate 101 already, for example, by a production by injection molding, as in 7b-2 shown is provided.

7b-3 shows the carrier substrate 101 after folding over the carrier substrate 101 such that the first carrier substrate portion 123 opposite to the second carrier substrate portion 125 is arranged, and that these two carrier substrate sections 123 . 125 over the third carrier substrate portion 127 or the connection section 127 connected to each other. An advantage of this method shown over in 7a The method shown is that adhesion promoter layers only on a carrier substrate portion of the carrier substrate 101 present to the second carrier substrate portion 125 with the channel structure elements 313a . 313b to connect while at the in 7a both adhesion promoter layers between the first carrier substrate section 123 and the channel structure elements 313a . 313b as well as between the second carrier substrate portion 125 and the two channel structure elements 313a . 313b available.

7c shows another example of connecting a carrier substrate with a channel structure to form a channel region. As with the example in 7b , is in the example in 7c the channel structure integral with the carrier substrate 101 educated. This in 7c Example shown differs from that in 7b shown example in that the carrier substrate is folded several times (in the in 7c shown example twice) to obtain the channel area.

7c-1 shows the carrier substrate 101 before the first folding step. Out 7c-1 it becomes clear that the channel structure 113 via a first connecting section 701 with the first carrier substrate portion 123 connected is. The first carrier substrate portion 123 is over the third carrier substrate portion 127 (which, for example, forms a second connecting portion) with the second carrier substrate portion 125 connected.

7c-2 shows the carrier substrate 101 after the first folding step. In this case, the carrier substrate 101 so folded that the channel structure 113 opposite to the first carrier substrate portion 123 lies and adjacent to these. In this step, the channel structure 113 equal to the first carrier substrate portion 123 be glued. Furthermore, it will be apparent that the first connection section 701 forms a first folding section. Following the first folding of the carrier substrate 101 can remove the excess parts of the channel structure 113 be removed, for example so that only two channel structure elements 313a . 313b remain. In 7c-2 is the part of the channel structure 113 hatched, which can be removed to later the channel area 117 to build. The structuring of the channel structure 113 can be done, for example, with one or more of the aforementioned structuring processes.

7c-3 shows the carrier substrate 101 after structuring the channel structure 113 , Therefore, only the two channel structure elements remain 313a . 313b left over, which are separated from each other.

In a further folding step, the channel area can now 117 by folding over the second carrier substrate section 125 and connecting it to the channel structure elements 313a . 313b be formed. The second carrier substrate portion 125 can, for example, with the two channel structure elements 313a . 313b be glued by means of a primer layer.

7c-4 shows the carrier substrate 101 after the second folding step. It is clear that the third carrier substrate section 127 , So the second connection section 127 a second folding portion of the supporting substrate 101 forms.

This in 7c Example shown has opposite to in 7b The example shown has the advantage that in the structuring of the carrier substrate 101 around the canal structure 113 to obtain less material from the carrier substrate 101 is removed, thereby reducing material costs.

7d shows another example of connecting a carrier substrate with a channel structure to form a channel region. As with the example in 7b and 7c , is in the example in 7d the channel structure integral with the carrier substrate 101 educated. This in 7d Example shown differs from those in the 7b and 7c shown by the fact that the carrier substrate is rolled to form the channel region.

7d-1 shows the carrier substrate 101 before rolling. Adjacent to the first Carrier substrate section 123 has the carrier substrate 101 a first tail 703 on. Adjacent to the second carrier substrate portion 125 has the carrier substrate 101 a second tail 705 on the first carrier substrate section 123 is over the third carrier substrate portion 127 (which, for example, forms a connecting portion) with the second carrier substrate portion 125 connected. The first main surface 103 of the carrier substrate 101 can be in the area of the second tail 705 an adhesive layer (or adhesive layer) and / or the second major surface 105 of the carrier substrate 101 can be in the area of the first tail 703 an adhesive layer (or primer layer) have.

7d-2 shows the carrier substrate 101 after roles. In this case, the carrier substrate 101 so rolled that the first main surface 103 of the carrier substrate 101 in the area of the second end piece 705 with the second main surface 105 of the carrier substrate 101 in the area of the first end piece 703 in contact. In this step, the first main surface 103 of the carrier substrate 101 in the area of the second end piece 705 with the second main surface 105 of the carrier substrate 101 in the area of the first end piece 703 connected (for example glued), for example by means of the adhesive layer between the first main surface 103 of the carrier substrate 101 and the second main surface 105 of the carrier substrate 101 in this overlap area. The first tail 703 For example, it may form a channel structure of the finished microfluidic module.

In 7d not shown are possible stabilization structures which are in the channel region 117 or adjacent to it to increase stability of the rolled microfluidic module. Furthermore, also the overlap area between the first end piece 703 and the second tail 705 of the carrier substrate 101 be chosen so that this to an increased stability of the carrier substrate 101 and an increased tightness of the channel region 117 contributes. For example, a length of the overlap area can be changed by changing the length of the end pieces 703 . 705 of the carrier substrate 101 be varied.

It is pointed out again that only for the sake of simplicity in the in 7a to 7d shown examples no functional elements on the carrier substrate 101 are arranged. Thus, during the production of a microfluidic module according to an exemplary embodiment of the present invention, at least one functional element typically becomes on a surface region of the carrier substrate 101 arranged before the first folding. For example, at the first carrier substrate portion 123 that in the in 3 and 6a shown electroluminescent component 309 be arranged and on the second carrier substrate portion 125 can the in the 3 and 6a shown organic field effect transistor 310 be arranged.

In the following, some aspects of embodiments of the present invention will briefly be summarized.

In further embodiments, a sensor arrangement may also be designed to perform an electrochemical detection. Thus, functional elements of the sensor arrangement can be arranged, for example, in the channel region or adjacent to the latter of a microfluidic module, for example on the first main surface of the carrier substrate. For example, an electrochemical reaction in the channel region may be created by mixing a sample with a reagent (which is upstream or added, for example, in the channel region), or by direct electrochemical activity of the analyte. By means of the electrical reaction (typically a redox reaction), the fluid in the channel region releases or picks up electrons from an electrode which strike the functional elements of the sensor arrangement and generate a voltage (potentiometric measurement) or a current (amperometric measurement) Measurement) that can be detected by the sensor assembly. Different analytes in the fluid can generate different voltages or currents, by means of which it is safe to make a statement about the fluid in the channel area (or the sample in the channel area).

In further embodiments, a sensor arrangement may be a capacitive sensor arrangement which is designed to detect a capacitance of a capacitor which is changed by a fluid in the channel region. In other words, based on a sample in the channel region, the capacitive sensor arrangement can detect or measure a changed dielectric property of the capacitor based on a capacitance change of the capacitor. For example, functional elements of the sensor arrangement can form capacitor plates of the capacitor, wherein the channel region is arranged between the capacitor plates and the sensor arrangement can detect a change in the capacitance of the capacitor. For example, the fluid in the channel region can form at least part of a dielectric between the two capacitor plates. Different fluids may have different dielectric constants and thus lead to different capacitances of the capacitor. On the basis of a measurement of the capacitance of the capacitor by the sensor arrangement, therefore, a statement about a Composition of the located in the channel region fluid (ie the sample) are taken. When the sensor arrangement is designed as a capacitive sensor arrangement, the functional elements can be arranged both on the first main surface of the carrier substrate (ie in the channel region or adjacent thereto) and on the second main surface of the carrier substrate (such that the carrier substrate is arranged between the channel region and the functional elements). be arranged.

The capacitive measurement can also take place with the aid of a bioassay which, by binding with molecules present in the fluid, specifically changes the dielectric constant in the environment of the capacitor. In this case preferably planar, z. B. interdigital capacitors are used, which can be arranged on one or both sides of the channel (channel region).

Embodiments of the present invention provide a polymer-based microfluidic module with integrated optical detection.

Further embodiments of the present invention provide a fully integrated lab and chip module with optical detection made on polymer substrate.

Embodiments of the present invention allow use of low cost polymeric materials and low cost manufacturing processes.

In some embodiments of the present invention, organic transistors are used as photodetectors or radiation detectors.

In further exemplary embodiments of the present invention, light-emitting elements that can be produced on films, such as, for example, electroluminescent components, are used cost-effectively.

Furthermore, in embodiments of the present invention, functional structures on both the lid and bottom of the lab-on-chip module are possible despite / by one-sided technological processing due to the folding solution, as they are based on the 6a to 7c has been described.

Furthermore, in some embodiments of the present invention, moisture susceptibility of the organic materials and their influence on the current of the transistor can be largely eliminated by a suitable measuring method.

Some embodiments allow fabrication of entire microfluidics, excitation, and detection on film substrates.

Furthermore, embodiments enable production of excitation, detection and microfluidics on a single film substrate by suitable process selection and assembly by convolution.

In some embodiments, film stacks are used as the fluidic substrate to reduce the adjustment effort in assembling the overall module.

Other embodiments use a transparent gate electrode for an organic phototransistor.

Further embodiments provide a measuring method for reducing the influence of (moisture and age-related) leakage currents in organic semiconductor structures in order to enable effective stabilization of the sensor. Embodiments therefore use the superiority of organic field effect transistors as detection elements over organic photodiodes.

Although some aspects have been described in the context of a device, it will be understood that these aspects also constitute a description of the corresponding method, so that a block or a component of a device is also to be understood as a corresponding method step or as a feature of a method step. Similarly, aspects described in connection with or as a method step also represent a description of a corresponding block or detail or feature of a corresponding device.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited non-patent literature

• http://www3.imperial.ac.uk/people/thomas.anthopoulos [0104]
• http://spie.org/x38725.xml?ArticleID=x38725 [0104]
• Solid State Electronics, Volume 51, Issue 7, July 2007, Pages 1052-1055, Yong-Young Noh, Dong-Yu Kim [0104]

Claims (28)

Microfluidic module for the analysis of fluids, comprising: a one-piece carrier substrate ( 101 ) with a first main surface ( 103 ) and one, the first main surface ( 103 ) opposite second major surface ( 105 ); a sensor arrangement ( 107 . 207a . 207b . 307 ), wherein a first functional element ( 109 . 209a . 209b . 309 ) of the sensor arrangement ( 107 . 207a . 207b . 307 ) at a first surface area ( 111 ) of the carrier substrate ( 101 ) is arranged; and a channel structure ( 113 ) with the first main surface ( 103 ) of the carrier substrate ( 101 ), so that a channel region ( 117 ) between the first surface area ( 111 ) of the carrier substrate ( 101 ) and one, the first surface area ( 111 ) opposite second surface area ( 115 ) of the carrier substrate ( 101 ) formed by the channel structure ( 113 ) and the carrier substrate ( 101 ) is surrounded. Microfluidic module according to claim 1, wherein the sensor arrangement ( 207a . 307 ) a second functional element ( 210a . 310 ), which at the second surface area ( 115 ) of the carrier substrate ( 101 ) is arranged; wherein the first functional element ( 209a . 309 ) a radiation source ( 209a . 309 ) and the second functional element ( 210a . 310 ) a radiation detector ( 210a . 310 ); and wherein a radiation-emitting surface ( 212a ) of the radiation source ( 209a . 309 ) the channel area ( 117 ) and a radiation-sensitive surface ( 214a ) of the radiation detector ( 210a . 310 ) the channel area ( 117 ), such that one, from the radiation source ( 209a . 309 ) emitted radiation the channel area ( 117 ) to access the radiation-sensitive surface ( 214a ) of the radiation detector ( 210a . 310 ) hold true. Microfluidic module according to claim 1, wherein the sensor arrangement ( 207b ) a second functional element ( 210b ), which at the first surface area ( 111 ) of the carrier substrate ( 101 ) is arranged; wherein the first functional element ( 209b ) a radiation source ( 209b ), and the second functional element ( 210b ) a radiation detector ( 210b ); and wherein a radiation-emitting surface ( 212b ) of the radiation source ( 209b ) and a radiation-sensitive surface ( 214b ) of the radiation detector ( 210b ) the channel area ( 117 ) such that one of the radiation source ( 209b ) emitted radiation at one in the channel region ( 117 ) is at least partially reflected or scattered or causes a luminescence emission, and that the resulting radiation at least partially on the radiation-sensitive surface ( 214b ) of the radiation detector ( 210b ) meets. Microfluidic module according to claim 1, wherein the sensor arrangement ( 207c ) a second functional element ( 210b ), which at the first surface area ( 111 ) of the carrier substrate ( 101 ), and in which the sensor arrangement ( 207c ) a third functional element ( 216 ), which at the second surface area ( 115 ) of the carrier substrate ( 101 ) is arranged; wherein the first functional element ( 209b ) a radiation source ( 209b ); wherein the second functional element ( 210b ) a radiation detector ( 210b ); wherein the third functional element ( 216 ) a reflection element ( 216 ); and wherein a radiation-emitting surface ( 212b ) of the radiation source ( 209b ), a radiation-sensitive surface ( 214b ) of the radiation detector ( 210b ) and a reflective surface ( 218 ) of the reflection element ( 216 ) the channel area ( 117 ) such that one, from the radiation source ( 209b ) emitted radiation the channel area ( 117 ) to access the reflective surface ( 218 ) of the reflection element ( 216 ) to hit from the reflective surface ( 218 ) of the reflection element ( 216 ) to be at least partially reflected to the channel region ( 117 ) again to access the radiation-sensitive surface ( 214b ) of the radiation detector ( 210b ) hold true. Microfluidic module according to one of Claims 2 to 4, in which the radiation source ( 209b . 309 ) a light source ( 209b . 309 ) and wherein the radiation detector ( 210b . 310 ) a light detector ( 210b . 310 ) and in which the carrier substrate ( 101 ) a common substrate ( 101 ) for the light source ( 209b . 309 ) and the light detector ( 210b . 310 ) forms; and wherein the light source ( 209b . 309 ) and the light detector ( 210b . 310 ), opposite one another, on the same main surface ( 105 ) of the carrier substrate ( 101 ) are arranged. Microfluidic module according to one of claims 2-5, wherein the radiation detector ( 310 ) is a semiconductor device and wherein a surface of a semiconductive layer ( 611 ) of the semiconductor device ( 310 ) the radiation-sensitive surface ( 214b ) of the semiconductor device ( 310 ), such that a photocurrent between an input terminal ( 613 ) and an output terminal ( 614 ) of the semiconductor device ( 310 ) depending on the semiconductive layer ( 611 ) of the semiconductor device ( 310 ) incident radiation is variable. Microfluidic module according to Claim 6, in which the semiconductor component ( 310 ) a transistor ( 310 ), wherein a potential at a control terminal of the transistor ( 310 ) within a tolerance range equal to a potential at the output terminal ( 614 ) of the transistor ( 310 ) and the input port ( 613 ) of the transistor ( 310 ) Reference potential, or wherein the potential at the control terminal of the transistor ( 310 ) within a tolerance range equal to a potential at the input terminal ( 613 ) of the transistor ( 310 ), and the output port ( 614 ) of the transistor ( 310 ) Has reference potential. Microfluidic module according to one of Claims 6 to 7, in which the semiconductor component ( 310 ) a transistor ( 310 ), wherein a control electrode ( 609 ) of the transistor ( 310 ), which between the semiconducting layer ( 611 ) of the transistor ( 310 ) and the channel area ( 117 ) is arranged, at least for the of the radiation source ( 309 ) emitted radiation is at least partially transparent to radiation. Microfluidic module according to one of Claims 6 to 8, in which the semiconductor component ( 310 ) an organic semiconductive component ( 310 ), wherein the semiconductive layer ( 611 ) of the organic semiconducting component ( 310 ) is formed of an organic semiconductor material. Microfluidic module according to one of claims 2 to 9, wherein the carrier substrate ( 101 ) at least in a first region between the channel region ( 117 ) and the radiation-emitting surface ( 212a . 212b ) of the radiation source ( 209a . 209b . 309 ) and in a second area between the channel area ( 117 ) and the radiation-sensitive surface ( 214a . 214b ) of the radiation detector ( 210a . 210b . 310 ) at least for the radiation source ( 209a . 209b . 309 ) emitted radiation is transparent to radiation. Microfluidic module according to one of claims 1 to 10, in which the first functional element ( 109 . 209a . 209b . 309 ) is an organic light-emitting diode (OLED) or in which the first functional element ( 109 . 209a . 209b . 309 ) an electroluminescent component ( 309 ). Microfluidic module according to one of claims 1 to 11, wherein the first surface area ( 111 ) and the second surface area ( 115 ) opposite portions of the second major surface ( 105 ) of the carrier substrate ( 101 ) are. The microfluidic module of claim 1, wherein the sensor assembly is configured to perform a capacitive or electrochemical measurement or to measure surface plasmons. Microfluidic module according to claim 13, in which a second functional element of the sensor arrangement is attached to the second surface region ( 115 ) of the carrier substrate ( 101 ), wherein the first functional element and the second functional element are arranged opposite one another on the same main surface ( 103 . 105 ) of the carrier substrate ( 101 ) are arranged. Microfluidic module according to claim 14, wherein the first surface area ( 111 ) and the second surface area ( 115 ) of the carrier substrate ( 101 ) opposite portions of the first main surface ( 103 ) of the carrier substrate ( 101 ), such that the first functional element and the second functional element on the first main surface ( 103 ) of the carrier substrate (101) are such that the functional elements adjacent to the channel region (FIG. 117 ) are arranged. Microfluidic module according to one of Claims 1 to 15, in which the first surface area ( 111 ) and the second surface area ( 115 ) to a common processing surface of the carrier substrate ( 101 ) belong. Microfluidic module according to one of Claims 1 to 16, in which the channel structure ( 113 . 313a . 313b ) and the carrier substrate ( 101 ) are made in one piece, and wherein the first main surface ( 103 ) of the carrier substrate by means of a bonding agent layer with the channel structure ( 113 . 313a . 313b ) connected is. Microfluidic module according to one of claims 1 to 17, wherein a first main surface ( 121 . 321a . 321b ) of the channel structure ( 113 . 313a . 313b ) with a first adhesion promoter layer having the first main surface ( 103 ) of the carrier substrate ( 101 ) and in which one, the first main surface ( 121 . 321a . 321b ) opposite second main surface ( 129 . 329a . 329b ) of the channel structure ( 113 . 313a . 313b ) with a second adhesion promoter layer having the first main surface ( 103 ) of the carrier substrate ( 101 ) connected is. Microfluidic module according to one of Claims 1 to 18, in which the channel structure ( 113 . 313a . 313b ) two through the channel area ( 117 ) separate channel structure elements ( 313a . 313b ) such that the channel region ( 117 ) between a page surface ( 320a ) of a first channel structure element ( 313a ) of the two separate channel structure elements ( 313a . 313b ) and a side surface ( 320b ) of a second channel structure element ( 313b ) of the two separate channel structure elements ( 313a . 313b ) and between two opposite carrier substrate sections ( 123 . 125 ) of the carrier substrate is formed; and wherein the two opposite carrier substrate sections ( 123 . 125 ) of the carrier substrate ( 101 ) via a connecting section ( 127 ) of the carrier substrate ( 101 ) are interconnected. Microfluidic module according to one of claims 1 to 18, wherein the channel structure ( 113 ) a channel structure element ( 113 ), wherein the channel region ( 117 ) between two opposite carrier substrate sections ( 123 . 125 ) of the carrier substrate ( 101 ) and between a side surface of the channel structure element ( 113 ) and a connecting section ( 127 ) of the carrier substrate ( 101 ), which covers the two opposite carrier substrate sections ( 123 . 125 ) of the carrier substrate ( 101 ) is connected to each other, is formed. Microfluidic module according to one of Claims 1 to 20, in which the carrier substrate ( 101 ) a flexible film substrate ( 101 ), wherein the flexible film substrate ( 101 ) has a minimum bend radius in a range of 5 μm-1 mm. Microfluidic module according to one of claims 1 to 21, in which the carrier substrate ( 101 ) and / or the channel structure ( 113 ) comprise a polymer material. Microfluidic module according to one of claims 1 to 22, in which the carrier substrate ( 101 ) comprises one of the following materials: polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polymethylmethacrylate, polystyrene, cycloolefin copolymer, polyetheretherketone, polyamide and / or wherein the channel structure ( 113 ) comprises one of the following materials: polyimide, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polymethylmethacrylate, polystyrene, cycloolefin copolymer, polyetheretherketone, polyamide. Method for producing a microfluidic module comprising the following steps: providing ( 501 ) a unitary carrier substrate having a first major surface and a second major surface opposite the first major surface, wherein a first functional element of a sensor array of the microfluidic module is disposed on a first surface region of the carrier substrate; Provide ( 502 ) a channel structure; and connect ( 503 ) of the channel structure with the first major surface of the carrier substrate, such that a channel region is formed between the first surface region of the carrier substrate and a second surface region of the carrier substrate opposite the first surface region, which is surrounded by the channel structure and the carrier substrate. The method of claim 24, wherein the provided one-piece carrier substrate comprises a second functional element of the sensor array on a second surface area of the carrier substrate; and wherein before the step ( 501 ), providing the carrier substrate, the method takes a step ( 504 ), arranging the first functional element on the first surface region of the carrier substrate and disposing the second functional element on the second surface region of the carrier substrate, wherein the first surface region and the second surface region of the carrier substrate belong to a common processing surface of the carrier substrate. A method according to claim 25, wherein, in the step ( 503 ), connecting the channel structure to the first main surface of the carrier substrate, the carrier substrate is folded over the channel structure, such that the first functional element is disposed opposite the second functional element and at least part of the channel region is located between the first functional element and the second functional element. A method according to any one of claims 24 to 26, before the step ( 501 ), providing the carrier substrate, comprises a step of perforating folding portions of the carrier substrate. A method according to any one of claims 24 to 27, before the step ( 502 ) of providing the channel structure, a step of disposing one or more adhesive layers on major surfaces of the channel structure, and then structuring the channel structure together with the adhesive layer (s)

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