US20030213716A1 - Wafer shipping and storage container - Google Patents

Wafer shipping and storage container Download PDF

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Publication number
US20030213716A1
US20030213716A1 US10/326,522 US32652202A US2003213716A1 US 20030213716 A1 US20030213716 A1 US 20030213716A1 US 32652202 A US32652202 A US 32652202A US 2003213716 A1 US2003213716 A1 US 2003213716A1
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Prior art keywords
tray
recess
container
base
adhesive
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Abandoned
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US10/326,522
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Brian Cleaver
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Individual
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67353Closed carriers specially adapted for a single substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67386Closed carriers characterised by the construction of the closed carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67396Closed carriers characterised by the presence of antistatic elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A wafer shipping and storage container includes a base, a tray, and a lid. The base is rigid providing a platform for the tray. The base has a tray recess dimensioned to be slightly larger than the tray. The tray recess has a plurality of elastic pillars attached that project away from the top surface. Each pillar is encompassed by an elastic stop shorter than the pillars. The tray has a wafer recess dimensioned to accept a disk. The perimeter of the top surface has a plurality of holes passing through the tray that correspond in size and placement to accept the pillars from the base. An additional adhesive recess may be recessed within the disk recess. The adhesive recess is sized to contain a gel adhesive or other releasable adhesive containing a plurality of support strands, which may be used to support and hold the disk within the tray. One or more vacuum openings may extend to the adhesive recess to pull the adhesive away from the disk when the disk is being removed from the tray. The lid is used to close the container.

Description

    CROSS REFERENCE TO OTHER APPLICATIONS
  • This application claims the benefit of U.S. Provisional Patent Application No. 60/381,555, filed May 17, 2002, which is hereby incorporated by reference in its entirety.[0001]
  • FIELD OF THE INVENTION
  • This invention relates generally to a container for storing and transporting thin flat objects including a variety of kinds of masks, display panels, hard disks, silicon wafers and the like, and more particularly for the storage and transport of a semiconductor wafer. [0002]
  • BACKGROUND OF THE INVENTION
  • Various prior art containers have been used in the electronics industry to protect and transport masks, displays, disks, and wafers. Sources of damage during storage and shipping include, but are not limited to, vibrations, abrasions, impacts, static electricity, and contaminants. [0003]
  • The high value and fragile nature of masks, displays, disks, and wafers requires a very reliable means for securing them within a container. Many containers are configured specifically for semiconductor wafers because they are particularly valuable and fragile. [0004]
  • In the past, semiconductor wafers were handled by the edges as a preferred method for storage and transportation. Consequently, known semiconductor wafer carriers were configured to support semiconductor wafers by the edges. [0005]
  • A continuing trend in the electronics industry is an increase in the diameter, and a decrease in the thickness of semiconductor wafers. As this trend has developed, it has become necessary to develop new techniques to store and transport wafers because the use of rigid supports on the edges of wafers is not sufficiently effective in protecting larger, more delicate wafers. [0006]
  • What is needed is a wafer shipping and storage container that adequately supports larger, thinner wafers, and that also protects them from common sources of damage. [0007]
  • SUMMARY OF THE INVENTION
  • The present invention takes the form of a wafer shipping and storage container including a base, a tray, and a lid. [0008]
  • A wafer or disk is first placed within the tray, next the tray is set to rest within the base, and finally the lid is placed on top of the base. Removal of the wafer or disk is accomplished by reversing the above steps. [0009]
  • In one embodiment of the invention, an additional step can aid in the removal of a wafer or disk from the tray. This step is useful when an adhesive member is used to secure a wafer or disk to the tray. A vacuum can be applied to one or more vacuum apertures (discussed below) on the bottom surface of the tray to pull an adhesive member away from the wafer or disk. [0010]
  • Referring to each part of the wafer shipping and storage container, and beginning with the base, the base is rigid providing a platform for the tray. The base has a top surface, and a bottom surface, the top surface has a recessed central portion forming a tray recess and a raised perimeter around the periphery of the tray recess. The tray recess is dimensioned to be slightly larger than the tray. The tray recess has a plurality of elastic pillars attached that project away from the top surface. Each pillar is encompassed by an elastic stop that projects away from the top surface, but does not project away from the top surface as far as the pillars project away from the top surface. [0011]
  • The next part of the shipping and storage container is the tray. A wafer or disk is set to rest on the tray, and the tray is set to rest within the base. The tray has a top surface and a bottom surface, the tray top surface having a disk recess and a raised perimeter around the periphery of the disk recess. The disk recess of the top surface has a first planar recessed section relative to the perimeter and is dimensioned to accept a disk. The perimeter of the top surface has a plurality of holes passing through the tray that correspond in size and placement to accept the pillars from the base. [0012]
  • An additional adhesive recess may be recessed within the disk recess. The adhesive recess is sized to contain a gel adhesive or other releasable adhesive having a plurality of support strands, which may be used to support and hold the disk within the tray. One or more vacuum openings may extend to the adhesive recess to pull the adhesive away from the disk when the disk is being removed from the tray. [0013]
  • The last part of the shipping and storage container is the lid. The lid is used to close the container. The lid has a top surface and a bottom surface, the top surface being on the outside of the container and the bottom surface being on the inside of the container when the container is closed.[0014]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective exploded view of one embodiment of the container of the invention, illustrating the packaging sequence. [0015]
  • FIG. 2 is cross-sectional view of one embodiment of the wafer shipping and storage container. [0016]
  • FIG. 3 is a perspective view of one embodiment of the base of the wafer shipping and storage container. [0017]
  • FIG. 4 is a top view of the base. [0018]
  • FIG. 5 is a bottom view of the base. [0019]
  • FIG. 6 is a perspective view of one embodiment of the tray of the wafer shipping and storage container. [0020]
  • FIG. 7 is a top view of the tray. [0021]
  • FIG. 8 is a bottom view of the tray. [0022]
  • FIG. 9 is a perspective view of one embodiment of the lid of the wafer shipping and storage container. [0023]
  • FIG. 10 is a top view of the lid. [0024]
  • FIG. 11 is a bottom view of the lid. [0025]
  • FIG. 12 is a perspective view of a second embodiment of the tray. [0026]
  • FIG. 13 is a perspective view of a third embodiment of the tray.[0027]
  • DESCRIPTION OF THE PREFERRED EMBODIMENT
  • In accord with the invention, a wafer shipping and storage container is disclosed. The wafer shipping and storage container may include a base, a tray, and a lid. [0028]
  • FIG. 1 is a perspective exploded view of one embodiment of the container of the invention, illustrating the packaging sequence. FIG. 2 illustrates a cross-sectional view of an embodiment of the invention. FIGS. [0029] 3-5 illustrate an embodiment of the base, FIGS. 6-8 illustrate an embodiment of the tray, and FIGS. 9-11 illustrate an embodiment of the lid.
  • Referring to FIG. 1, the container is loaded in the following way: a wafer or [0030] disk 140 is first placed within the tray 120, next the tray 120 is set to rest within the base 110, and finally the lid 130 is placed on top of the base 110. Removal of the wafer or disk 140 is accomplished by reversing the above steps.
  • In some embodiments of the invention, an additional step can aid in the removal of a wafer or disk from the tray. This step is useful when an adhesive member is used to secure a wafer or disk to the tray. A vacuum can be applied to one or more vacuum apertures (discussed below) on the bottom surface of the tray to pull one or more adhesive members away from the wafer or disk. [0031]
  • A preferred method of shipping the [0032] container 100 of the invention is to place the container 100 within a trampoline box. Trampolines are known in the art and consist of essentially a piece of elastic film stretched across a frame made of cardboard. Two trampolines are utilized. One trampoline is placed on the top of the container, and one on the bottom of the container, and these are then placed within a box and sealed. This allows the container 100 to rest within a cushion when shipped.
  • A detailed description of an exemplary embodiment of the invention will now be made with reference to the FIGS. [0033] 1-11, wherein like features are identified by like numbers. Although the embodiment described herein is configured for holding a wafer, the invention could easily be modified by one of ordinary skill for storing other materials including hard disks, photomasks, liquid crystal displays, flat panel displays, or other items could also be shipped and stored using this system.
  • The [0034] base 110 has a top surface, best seen in FIGS. 3 and 4, and a bottom surface shown in FIG. 5. The top surface includes a tray recess 410 and a perimeter 420. The perimeter 420 forms a raised wall around the recessed tray recess 410. The tray recess 410 is dimensioned to be slightly larger than the tray 120 (best seen in FIG. 1). The perimeter 420 of the top surface has a plurality of holes 430 that pass entirely through the base 110. The tray recess 410 of the top surface of the base 110 has a plurality of elastic pillars 310 attached that project away from the top surface. Each pillar 310 is encompassed by an elastic stop 320 that projects away from the top surface a distance less than the distance that the pillars 310 project. These elastic components serve at least two purposes: first, as electrical insulators, and second, as cushions that flex some, but prevent the tray from contacting other parts of the base 110. The perimeter 420 of the top surface also has one or more recessed portions 470 to allow for removal of the tray 120. The depressions 470 may be used to allow access to the underside of the tray 120 to assist in the removal or manipulation of tray 120. In some embodiments, ridges 460 are molded into the walls of the tray recess 410 of the base 110. These ridges 460 provide structural rigidity to the base 110. The base is shown in the FIGS. 1, and 3-5 as being made of a clear plastic material, however, many kinds of materials including opaque materials may be useable.
  • The [0035] tray 120 has a top surface shown in FIGS. 1, 6, and 7, and a bottom surface shown in FIG. 8, the tray top surface includes a disk recess 710 and a perimeter 720. The perimeter 720 forms a wall around the recessed disk recess 710. The disk recess is dimensioned to accept a disk 140. The perimeter 720 of the top surface has a plurality of holes 730 passing entirely through the tray 120 that correspond in size and placement to the pillars 310 from the base 110. The perimeter 720 of the top surface of the tray 120 also has one or more recessed portions 750 to further enable removal of a disk 140 from the tray 120. The disk recess 710 also has one or more vacuum apertures 810 passing through the tray 120. The disk recess 710 of the top surface may also have an adhesive recess 735 into which a generally flat adhesive member 740 is located. The vacuum aperture 810 is located below the adhesive member 740. The adhesive member 740 covers the vacuum aperture 810 and forms a surface that lies in roughly the same plane as the bottom of the disk recess 710. A preferred adhesive member 740 is a gel that is adhesive but can be separated from a disk 140 easily.
  • The [0036] adhesive member 740 has a plurality of strands 745 of less elastic material running through the adhesive. Although many other materials may be used, currently, a plastic, such as nylon, is used to form the strands 745. Other possible materials for the strands 745 include wire and fibrous materials. The strands 745 may be woven as shown to form a latticework or the strands may be layered or extend in only a single or in a plurality of directions. The adhesive material is selected such that it leaves no discernible residue on the disk once the disk is removed from the tray 120. Currently, an adhesive such as GEL-PAK is used. When a vacuum is connected to the vacuum aperture 810, the adhesive is pulled away from the disk 140 in the spaces between the strands 745, thereby decreasing the hold on the disk 140. The strength of the adhesive, the number, location and size of the strands 745, and the strength of the vacuum are variable. These factors are selected such that, when the vacuum is present, the adhesion of the adhesive above the strands 745 will allow a user to remove the disk 140 without damaging or breaking the disk 140. These factors are also selected such that the adhesion when the vacuum is not present is sufficient to hold the disk 140 in place during transport of the disk 140 within the container 100. The adhesive member 740 may be virtually any size. For most current applications, the width of the patch is typically in the range of 0.5-3.0 or more inches.
  • To remove the [0037] disk 140 from the tray 120, a vacuum is attached to the vacuum aperture 810. Once the vacuum is attached, the system is hermetically sealed and the vacuum pressure will pull the adhesive 740 away from the disk 140, thereby allowing the user to easily and safely remove the disk.
  • Although the drawings show the [0038] adhesive member 740 confined to a square section in the middle of the top surface of the tray 120, in alternate embodiments other adhesive configurations may be used. For example, other shapes and sizes of an adhesive member 740 may be used. In other embodiments, adhesive members and adhesive recesses with appropriate vacuum apertures positioned at other locations in the disk recess 710, such as that shown in FIG. 12. Another embodiment contemplated is that of a centered adhesive member having radiating members that reach out across the disk recess 710, as seen in FIG. 13. These alternate configurations could use a set of vacuum channels 738 that connect to all of the adhesive members 740 or they could use a plurality of vacuum apertures 810 that connect to a plurality of ports on one or more vacuum generating devices. Although only one would typically be used or built into a tray 120, in FIG. 13, both the additional vacuum apertures 810 and the vacuum channels 738 are shown.
  • Some preferred embodiments of the [0039] tray 120 may include one or more wafer latches that contact an upper surface of the edge of the wafer 140 to hold the wafer 140 against the disk recess 710 of the tray. FIGS. 6-8 shows an example of a latching mechanism including a slot 780 with a slideable latch 760 in the open position. When the slideable latch 760 is moved to one end of the slot a portion of the latch overlaps the edge of the wafer 140, preventing the wafer from moving upward off of the cassette disk recess 710. When the latch 760 is slid to the other end of slot 780, the edge of the wafer 140 is released. Many known latching systems may be useable, and the invention is not limited to those latches shown or discussed herein.
  • FIG. 8, which is a bottom view of the [0040] tray 120, shows the vacuum aperture 810 on the bottom surface. As discussed above, by applying a vacuum to this aperture, the adhesive member 740 on the opposite surface is pulled away from a disk 140, thereby allowing the disk 140 to be more easily removed. In alternate embodiments such as those shown in FIGS. 12 and 13, additional vacuum apertures associated with additional adhesive members may be included. In still other embodiments, vacuum tubes may extend form a single vacuum aperture to a plurality of locations such as a plurality of adhesive members 740.
  • The [0041] lid 130 has a top surface shown in FIGS. 1, 9, and 10 and a bottom surface shown in FIG. 11. The top surface is on the outside of the container 100 and the bottom surface is on the inside of the container 100 when the container 100 is closed. The lid is shown as being made of a clear plastic material, however, many kinds of materials including opaque materials may be useable. The top surface includes an exterior 1020 and an interior 1010. The exterior 1020 of the top surface contacts the perimeter 720 of the top surface of the tray 120 when the container is closed. The exterior 1020 surface has a plurality of locking apertures 910 that correspond in placement to pass through the holes 430 in the base 110 to secure the lid 130 to the base 110. Locking members will be inserted through and extend through locking apertures 910 and holes 430 to fasten the lid 130 and the base 110 together. The lid 130 also has a plurality of elastic bumpers 210 that extend from the bottom surface of the lid a distance sufficient for the elastic bumpers 210 to make contact with the top surface of the perimeter 720 of the tray 120 when the lid 130 is placed on top of the base 110 and tray 120. These elastic bumpers 210 are conductive rubber bushings that prevent build up of static electrical charges that may harm a wafer 140. The lid also has a plurality of indentations 920 that may help prevent a wafer 140 from leaving the tray 120.
  • Referring again to FIG. 2, a cross-sectional view of the wafer shipping and [0042] storage container 100 is shown. It illustrates the elastic bumpers 210 projecting from the bottom surface of the lid 130. The elastic bumpers 210 are held in place by a projection 215 extending from the bottom surface of the lid 130. Additionally, FIG. 2 illustrates the tray 120 resting on the elastic stops 320 of the base 110, and the holes 730 of the tray 120 that are filled by the elastic pillars 310 of the base 110. Also, the tray 120 does not actually come into contact with base 110, except for contact with the elastic stops 320 and elastic pillars 310. However, the lid 130 does contact the perimeter of the tray's 120 top perimeter 720 surface as seen in FIG. 2. Additionally, the elastic bumpers 210 make contact with the perimeter 720 top surface of the tray 120. Also seen in FIG. 2 is flange 930 of the lid 130, which assists in holding the container 100 together. Although the lid may be formed in any convenient manner, the embodiment shown is formed of a generally flat sheet of material that is vacuum formed to create the depressions and raised portions necessary.
  • In the preferred embodiment, the wafer shipping and storage container comprises material that is sturdy, that does not outgas or otherwise harm a semiconductor wafer, and has favorable electrostatic properties to prevent static charge build up. The material may be clear or opaque. Additionally, the elastic pillars and stops, as well as the elastic bumpers are also made from a conductive elastomeric material. [0043]
  • To those skilled in the art, many changes and modifications will be readily apparent from the consideration of the foregoing description of a preferred embodiment without departure from the spirit of the present invention. The description herein and the disclosures hereof are by way of illustration only and should not be construed as limiting the scope of the present invention. [0044]

Claims (19)

What is claimed is:
1. A tray for holding a fragile item, the tray comprising:
a top surface,
a first recess in said top surface, said first recess sized and configured such that the fragile item is locatable therein, a first recess base forming a bottom of said first recess,
a second recess in said first recess, said second recess having a second recess base forming a bottom of said second recess,
an adhesive located in said second recess,
and a vacuum opening extending through said second recess base and located adjacent a bottom surface of said adhesive.
2. The tray of claim 1, wherein said adhesive is pliable.
3. The tray of claim 1, further comprising a plurality of strands of material extending through said adhesive, said strands formed of a material less elastic than said adhesive.
4. The tray of claim 3, wherein said strands are woven into a latticework.
5. The tray of claim 3, wherein said strands are formed of plastic.
6. The tray of claim 1, wherein said adhesive forms a patch at least 0.5 inches across.
7. The tray of claim 1, wherein said adhesive forms a patch at least 1.0 inch across.
8. The tray of claim 1, wherein said adhesive is GEL-PAK.
9. The tray of claim 1, further comprising a container for holding said tray, said container comprising:
a container base,
and a mating container lid,
wherein said container base and container lid are sized such that, when said tray is located therein, said tray is held securely.
10. The container and tray of claim 9, wherein said tray has a plurality of holes extending through a perimeter of said tray.
11. The container and tray of claim 10, wherein said container base has a plurality of elastic pillars extending upward from a top surface thereof, said pillars sized, configured and located to fit within said plurality of holes in said tray, and further comprising an elastic stop surrounding each of said plurality of elastic pillars, said elastic stops sized and configured to support said tray.
12. The container and tray of claim 11, wherein said lid has a plurality of projections extending from the bottom surface of said lid, and further comprising a plurality of elastic bumpers sized and configured to attach around each of said projections.
13. The container and tray of claim 12, wherein said projections are sized and located such that, when said lid is mated with said container base with a tray therein, said elastic bumpers are located near said holes in said tray and said elastic pillars.
14. The container and tray of claim 9, wherein said container base and lid are formed of a generally rigid material.
15. The container and tray of claim 9, wherein a perimeter of said lid is stepped and a perimeter of said container base is stepped, the steps of said lid and base are sized and configured to hold said container together.
16. The container and tray of claim 9, wherein said container base further comprises a plurality of ridges extending across at least a portion of said base.
17. The tray of claim 1, further comprising a latch adjacent said first recess, said latch having an open position and a closed position, said latch configured to hold a disk within said first recess when said latch is in said closed position.
18. The tray of claim 1, further comprising a pair of disk removal recesses located adjacent an edge of said first recess, a bottom surface of said disk removal recess at a lower elevation than said first recess base.
19. The tray of claim 18, wherein said disk removal recess extends to an edge of said tray.
US10/326,522 2002-05-17 2002-12-20 Wafer shipping and storage container Abandoned US20030213716A1 (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050103668A1 (en) * 2003-11-18 2005-05-19 Mikio Fukui Hermetically sealed container for large-sized precision sheet (semi-) product
EP1603156A2 (en) * 2004-06-03 2005-12-07 Convey Incorporated Integrated circuit wafer packaging system and method
US20090038976A1 (en) * 2007-08-10 2009-02-12 Chih-Ming Lin Container and foolproof device thereof
US20140166522A1 (en) * 2012-12-14 2014-06-19 Shenzhen China Star Optoelectronics Technology Co., Ltd. Packing Box for Liquid Crystal Display Panel and Waterproof Structure Thereof
US9958772B1 (en) * 2017-01-26 2018-05-01 Gudeng Precision Industrial Co., Ltd. Reticle pod
CN109309146A (en) * 2018-11-30 2019-02-05 江苏润阳悦达光伏科技有限公司 Photovoltaic silicon wafer storing unit
US20220102178A1 (en) * 2020-09-30 2022-03-31 Gudeng Precision Industrial Co., Ltd. Reticle pod having anti-collision gap structure

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469686A (en) * 1967-02-08 1969-09-30 Monsanto Co Retaining trays for semiconductor wafers and the like
US3661253A (en) * 1969-12-04 1972-05-09 Monsanto Co Retaining trays for semiconductor wafers and the like
US3864755A (en) * 1973-08-20 1975-02-04 Memorex Corp Thermoformed cartridge for a magnetic record disc
US4767002A (en) * 1986-01-14 1988-08-30 W. R. Grace & Co. Multiple circuit board carrier/shipper
US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4784267A (en) * 1987-07-20 1988-11-15 Gessler Annette L Surgical sponge counter and disposal container
US4817799A (en) * 1986-10-06 1989-04-04 Empak, Inc. Disk package
US4966281A (en) * 1988-09-09 1990-10-30 Nitto Denko Corporation Electronic component carrier
US4977475A (en) * 1988-03-31 1990-12-11 Tdk Corporation Lining member for the surface of a casing for a disc cartridge
US5168993A (en) * 1991-08-26 1992-12-08 Yen Yung Tsai Optical pellicle holder
US5305878A (en) * 1993-04-01 1994-04-26 Yen Yung Tsai Packaged optical pellicle
US5405000A (en) * 1994-02-28 1995-04-11 Hagedon; Bryan D. Protective suspension package
US5526936A (en) * 1993-12-27 1996-06-18 Gold Industries Co., Ltd. Tray assembly for transporting precision devices
US5545471A (en) * 1993-08-25 1996-08-13 Lee; Yong I. Electroconductive adhesive tape
US5703493A (en) * 1995-10-25 1997-12-30 Motorola, Inc. Wafer holder for semiconductor applications
US5729963A (en) * 1995-07-11 1998-03-24 Minnesota Mining And Manufacturing Company Component carrier tape
US5819927A (en) * 1997-02-24 1998-10-13 Yeh; Sheng-Fu CD container storage device
US5881871A (en) * 1997-05-08 1999-03-16 Tdk Corporation Cartridge receiving casing
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469686A (en) * 1967-02-08 1969-09-30 Monsanto Co Retaining trays for semiconductor wafers and the like
US3661253A (en) * 1969-12-04 1972-05-09 Monsanto Co Retaining trays for semiconductor wafers and the like
US3864755A (en) * 1973-08-20 1975-02-04 Memorex Corp Thermoformed cartridge for a magnetic record disc
US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4767002A (en) * 1986-01-14 1988-08-30 W. R. Grace & Co. Multiple circuit board carrier/shipper
US4817799A (en) * 1986-10-06 1989-04-04 Empak, Inc. Disk package
US4784267A (en) * 1987-07-20 1988-11-15 Gessler Annette L Surgical sponge counter and disposal container
US4977475A (en) * 1988-03-31 1990-12-11 Tdk Corporation Lining member for the surface of a casing for a disc cartridge
US4966281A (en) * 1988-09-09 1990-10-30 Nitto Denko Corporation Electronic component carrier
US5168993A (en) * 1991-08-26 1992-12-08 Yen Yung Tsai Optical pellicle holder
US5305878A (en) * 1993-04-01 1994-04-26 Yen Yung Tsai Packaged optical pellicle
US5545471A (en) * 1993-08-25 1996-08-13 Lee; Yong I. Electroconductive adhesive tape
US5526936A (en) * 1993-12-27 1996-06-18 Gold Industries Co., Ltd. Tray assembly for transporting precision devices
US5405000A (en) * 1994-02-28 1995-04-11 Hagedon; Bryan D. Protective suspension package
US5729963A (en) * 1995-07-11 1998-03-24 Minnesota Mining And Manufacturing Company Component carrier tape
US5703493A (en) * 1995-10-25 1997-12-30 Motorola, Inc. Wafer holder for semiconductor applications
US5819927A (en) * 1997-02-24 1998-10-13 Yeh; Sheng-Fu CD container storage device
US5881871A (en) * 1997-05-08 1999-03-16 Tdk Corporation Cartridge receiving casing
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050269241A1 (en) * 2003-06-06 2005-12-08 Brooks Ray G Integrated circuit wafer packaging system and method
US20080185315A9 (en) * 2003-06-06 2008-08-07 Brooks Ray G Integrated circuit wafer packaging system and method
US7578392B2 (en) 2003-06-06 2009-08-25 Convey Incorporated Integrated circuit wafer packaging system and method
US20050103668A1 (en) * 2003-11-18 2005-05-19 Mikio Fukui Hermetically sealed container for large-sized precision sheet (semi-) product
EP1603156A2 (en) * 2004-06-03 2005-12-07 Convey Incorporated Integrated circuit wafer packaging system and method
EP1603156A3 (en) * 2004-06-03 2006-03-08 Convey Incorporated Integrated circuit wafer packaging system and method
US20090038976A1 (en) * 2007-08-10 2009-02-12 Chih-Ming Lin Container and foolproof device thereof
US20140166522A1 (en) * 2012-12-14 2014-06-19 Shenzhen China Star Optoelectronics Technology Co., Ltd. Packing Box for Liquid Crystal Display Panel and Waterproof Structure Thereof
US8939289B2 (en) * 2012-12-14 2015-01-27 Shenzhen China Star Optoelectronics Technology Co., Ltd Packing box for liquid crystal display panel and waterproof structure thereof
US9958772B1 (en) * 2017-01-26 2018-05-01 Gudeng Precision Industrial Co., Ltd. Reticle pod
CN109309146A (en) * 2018-11-30 2019-02-05 江苏润阳悦达光伏科技有限公司 Photovoltaic silicon wafer storing unit
US20220102178A1 (en) * 2020-09-30 2022-03-31 Gudeng Precision Industrial Co., Ltd. Reticle pod having anti-collision gap structure

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