WO2002103762A3 - Pod door opener - Google Patents

Pod door opener Download PDF

Info

Publication number
WO2002103762A3
WO2002103762A3 PCT/US2002/021013 US0221013W WO02103762A3 WO 2002103762 A3 WO2002103762 A3 WO 2002103762A3 US 0221013 W US0221013 W US 0221013W WO 02103762 A3 WO02103762 A3 WO 02103762A3
Authority
WO
WIPO (PCT)
Prior art keywords
pod
wafer
door
opening
pod door
Prior art date
Application number
PCT/US2002/021013
Other languages
French (fr)
Other versions
WO2002103762A2 (en
Inventor
Ilya Di Perlov
Eugene Gantvarg
Howard E Grunes
Alexey Goder
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002103762A2 publication Critical patent/WO2002103762A2/en
Publication of WO2002103762A3 publication Critical patent/WO2002103762A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

A pod opening station moves a wafer-carrying pod horizontally to engage a door of the pod with a pod door receiver. The pod door receiver removes and holds the pod door with no vertical movement thereof. The pod is then moved horizontally in a reverse direction a short distance away from the pod door receiver. Then the pod is moved vertically into alignment with an opening in an interface wall. A wafer handler blade is extended through the opening into the pod. The pod is indexed downwardly to transfer a wafer to the wafer handler blade. The wafer handler blade then retracts to remove the wafer from the pod.
PCT/US2002/021013 2001-06-14 2002-06-12 Pod door opener WO2002103762A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/882,130 US20020006322A1 (en) 2000-03-06 2001-06-14 Pod door opener
US09/882,130 2001-06-14

Publications (2)

Publication Number Publication Date
WO2002103762A2 WO2002103762A2 (en) 2002-12-27
WO2002103762A3 true WO2002103762A3 (en) 2003-07-24

Family

ID=25379949

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/021013 WO2002103762A2 (en) 2001-06-14 2002-06-12 Pod door opener

Country Status (2)

Country Link
US (1) US20020006322A1 (en)
WO (1) WO2002103762A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717171B2 (en) * 2001-06-05 2004-04-06 Semitool, Inc. Method and apparatus for accessing microelectronic workpiece containers
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US6914251B1 (en) * 2003-03-07 2005-07-05 Axcelis Technologies, Inc. Alignment structure and method for mating a wafer delivery device to a wafer treatment tool
TWI251858B (en) * 2004-09-17 2006-03-21 Ind Tech Res Inst Six-linkage positioning mechanism
JP5408800B2 (en) * 2010-09-10 2014-02-05 Ｔｄｋ株式会社 Load port device
JP6099945B2 (en) * 2012-11-22 2017-03-22 東京エレクトロン株式会社 Lid opening / closing mechanism, shielding mechanism and internal purging method of container
CN103280420B (en) * 2013-06-04 2015-11-25 上海华力微电子有限公司 The method of wafer bearing device and wafer reviewing
US10403514B1 (en) * 2018-04-12 2019-09-03 Asm Ip Holding B.V. Substrate transporting system, storage medium and substrate transporting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6053688A (en) * 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
US6082951A (en) * 1998-01-23 2000-07-04 Applied Materials, Inc. Wafer cassette load station

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6053688A (en) * 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
US6082951A (en) * 1998-01-23 2000-07-04 Applied Materials, Inc. Wafer cassette load station

Also Published As

Publication number Publication date
US20020006322A1 (en) 2002-01-17
WO2002103762A2 (en) 2002-12-27

Similar Documents

Publication Publication Date Title
WO2002103762A3 (en) Pod door opener
WO2004006292A3 (en) Photovoltaic cell
AU2001291257A1 (en) Multigate semiconductor device with vertical channel current and method of fabrication
DE60027994D1 (en) Semiconductor arrangement with a crystalline alkaline earth metal - silicon nitride / oxide interface with silicon
TW200616096A (en) Method of forming a nanocluster charge storage device
WO2002035615A3 (en) Precursor solutions and methods of using same
HK1081325A1 (en) Vertical gate semiconductor device with a self-aligned structure
WO1999043582A8 (en) Door assembly for semiconductor wafer manufacturing
WO2020125728A1 (en) Old person anti-lost device based on nb-iot narrowband internet of things technology
AU2953000A (en) Semiconductor device with deep substrate contacts
US7179093B2 (en) Retractable ledge socket
CN213627259U (en) Voice control intelligent door and window device
SG139541A1 (en) Thyristor-based sram and method using quasi-planar finfet process for fabrication thereof
CN101661885A (en) Annealing treatment method for thinned or scribed gallium nitride base field-effect tube
CN112377054A (en) Portable glass door of integral type for interior decoration
CN208781813U (en) The wafer cleaning gaily decorated basket and wafer cleaning system
WO2002027060A8 (en) Process chamber lid service system
CN220206722U (en) Environment monitoring terminal structure
CN205880970U (en) Intelligence electron trick lock based on thing networking
TWI256134B (en) Power semiconductor device with L-shaped source region
CN215073376U (en) Data acquisition equipment for big data collection
CN219696963U (en) Dustproof electrical box
EP1326274A3 (en) System for improving thermal stability of copper damascene structure
CN210328302U (en) Novel draw-in groove stretchable waterproof equipment
CN218275240U (en) Waterproof cover of mouth charges

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP KR

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP