WO2007029981A1 - Ceramic heater - Google Patents

Ceramic heater Download PDF

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Publication number
WO2007029981A1
WO2007029981A1 PCT/KR2006/003570 KR2006003570W WO2007029981A1 WO 2007029981 A1 WO2007029981 A1 WO 2007029981A1 KR 2006003570 W KR2006003570 W KR 2006003570W WO 2007029981 A1 WO2007029981 A1 WO 2007029981A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
ceramic heater
temperature sensor
circuit
heating circuit
Prior art date
Application number
PCT/KR2006/003570
Other languages
French (fr)
Inventor
Youn-Seob Lee
Hyeung-Gyu Lee
Seung-An You
Original Assignee
Smattech. Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050083532A external-priority patent/KR100782063B1/en
Application filed by Smattech. Inc. filed Critical Smattech. Inc.
Publication of WO2007029981A1 publication Critical patent/WO2007029981A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic

Definitions

  • the present invention relates to a ceramic heater, and more particularly, to a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as screen printing or photolithography, and a layering technique.
  • a precision circuit forming technique such as screen printing or photolithography
  • a conventional ceramic heater is composed simply of a heating circuit, and its temperature is controlled by an analogue or digital method.
  • each temperature control method using the conventional heater has the following problems.
  • the analogue method reads a change in the resistance with respect to the temperature of the heating circuit itself, to thereby detect the temperature.
  • a problem of this method is that it cannot raise the temperature quickly enough because resistance reading and voltage application should be switched by turns.
  • the digital method uses an external, removable temperature sensor.
  • Such an external removable temperature sensor shows large differences (2O 0 C) in temperature sensing, depending upon its locations and attachment methods. Therefore, it is very difficult to precisely control the temperature, which makes temperature control through the digital method uneasy. Disclosure of Invention
  • the present invention has been made in view of the above drawbacks, and it is, therefore, an object of the present invention to provide a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as a screen printing or photolithography, and a layering technique.
  • the temperature sensor circuit may be screen-printed or pho- tolithographically formed onto a board of ceramic or metallic material or onto a board of composite material of ceramics -metal system (i.e., cermet materials).
  • a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; a temperature sensor circuit positioned between the patterns of the heating circuit; and a second board layered on the first board.
  • a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; and a temperature sensor circuit provided on a separate surface other than the surface of the heating circuit.
  • the present invention in case where the present invention is used in a digital temperature control method, it can measure the temperature data very precisely (within 3 0 C) when it is built in the same position all the time.
  • the temperature control can be made digitally, so that heaters requiring high precision temperature control can remarkably improve their performances.
  • the present invention can be advantageously employed in ceramic heaters in various shapes such as a plate shape (circular and rectangular), cylindrical, cubic structure and the like.
  • FIG. 1 illustrates a ceramic heater according to one preferred embodiment of the present invention
  • FIG. 2 illustrates a ceramic heater according to another preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
  • the ceramic heater of a first embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, a temperature sensor circuit 12 located between the predefined patterns of the heating circuit 14, and a second board 16 layered on the first board 10.
  • the temperature sensor circuit 12 and the heating circuit 14 are formed in predetermined patterns on the upper portion of the first board 10.
  • the temperature sensor circuit 12 and the heating circuit 14 can be formed directly on the upper portion of the first board 10 through a screen-printing technique, or one of the patterns of either the temperature sensor circuit 12 or the heating circuit 14 can be formed on the upper portion of the first board 10 by a semiconductor process such as photolithography, and then materials of the heating circuit or the temperature sensor circuit are subjected to a process such as deposition. Thereafter, the pattern of the remaining temperature sensor circuit or heating circuit is formed on the upper portion of the second board 16 by a photolithographic technique in the same manner followed by being deposited.
  • FIG. 1 illustrates the first board 10 and the second board 16 in a rectangular plate shape, they may be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
  • a non-described reference numeral 20 denotes a wire.
  • the ceramic heater of the structure as described above has the temperature sensor circuit 12 arranged between the patterns of the heating circuit 14, to help the temperature sensor circuit 12 accurately sense the heating temperature so that a user can precisely control the heating temperature of the ceramic heater.
  • the heating circuit 14 and the temperature sensor circuit 12 receive electric power through the wire 20 that is separately connected for heating, and then output the sensed heating temperature to a controller (not shown).
  • the heating circuit 12 used in the present invention is made of Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy or a mixture of these.
  • the temperature sensor circuit is made of heating materials such as Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof, NTC thermistor materials, PTC thermistor materials, Pt, or a mixture thereof.
  • the NTC thermistor materials include Mn, CO, Ni, Fe and the like.
  • Examples of the PTC thermistor materials include BaTiC ⁇ , Y, Ce, La, Sn and the like.
  • the ceramic heater according to a second embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, an intermediate board 18 layered on the first board 10, a temperature sensor circuit 12 formed in a predetermined pattern on an upper portion of the intermediate board 18, and a second board 16 layered on the intermediate board 18.
  • the heating circuit 14 and the temperature sensor circuit 12 are formed in predetermined patterns on the upper portion of the first board 10 and the intermediate board 18, respectively. As in the first embodiment, the temperature sensor circuit 12 and the heating circuit 14 are formed by screen-printing or photolithography and deposition.
  • the first board 10, the intermediate board 18 and the second board 16 are in a rectangular plate shape as depicted in FIG. 2, but they can be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
  • the temperature sensor circuit 12 and the heating circuit 14 are formed on their respective boards 10 and 18. However, the heating circuit 14 receives electric power through a wire 20 which is separately connected for heating, and the temperature sensor circuit 12 outputs a sensed heating temperature to a controller (not shown) through the wire 20.
  • the temperature sensor circuit 12 is closely adhered to the heating circuit 14 having the board 18 being in the middle, so it is not directly affected by heat generated by the heating circuit 14, thereby preventing any damage from the heat.

Abstract

Disclosed is a ceramic heater provided with a built-in heating circuit and a built-in temperature sensor circuit, which is manufactured by a cofiring process based on a precision circuit forming technique and a layering technique. The ceramic heater includes a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; a temperature sensor circuit positioned between the patterns of the heating circuit; and a second board layered on the first board.

Description

Description
CERAMIC HEATER
Technical Field
[1] The present invention relates to a ceramic heater, and more particularly, to a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as screen printing or photolithography, and a layering technique. Background Art
[2] A conventional ceramic heater is composed simply of a heating circuit, and its temperature is controlled by an analogue or digital method. However, each temperature control method using the conventional heater has the following problems.
[3] First, the analogue method reads a change in the resistance with respect to the temperature of the heating circuit itself, to thereby detect the temperature. A problem of this method is that it cannot raise the temperature quickly enough because resistance reading and voltage application should be switched by turns.
[4] In addition, there is a high possibility that the switching circuit may become defective in operation. When the switching circuit does not function normally, temperature is not detectable and this can lead to overheating and damages to the heater. To be short, the analog method has problems of a slow temperature increase, and overheating caused by the malfunctioning of the switching circuit.
[5] Second, the digital method uses an external, removable temperature sensor. Such an external removable temperature sensor shows large differences (2O0C) in temperature sensing, depending upon its locations and attachment methods. Therefore, it is very difficult to precisely control the temperature, which makes temperature control through the digital method uneasy. Disclosure of Invention
Technical Problem
[6] The present invention has been made in view of the above drawbacks, and it is, therefore, an object of the present invention to provide a ceramic heater incorporating a heating circuit and a separate temperature sensor circuit therein, which is manufactured by a cofiring process based on a precision circuit forming technique, such as a screen printing or photolithography, and a layering technique.
[7] It is another object of the present invention to provide a ceramic heater with high detection accuracy of temperature by comprising a heating circuit made of materials excellent in heating performance and a temperature sensor circuit that is very sensitive to temperature changes. The temperature sensor circuit may be screen-printed or pho- tolithographically formed onto a board of ceramic or metallic material or onto a board of composite material of ceramics -metal system (i.e., cermet materials). Technical Solution
[8] In accordance with one aspect of the present invention to achieve the above objects, there is provided a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; a temperature sensor circuit positioned between the patterns of the heating circuit; and a second board layered on the first board.
[9] In accordance with another aspect of the present invention, there is provided a ceramic heater including: a first board; a heating circuit formed in predetermined patterns on an upper portion of the first board; and a temperature sensor circuit provided on a separate surface other than the surface of the heating circuit.
[10] The other objectives and advantages of the invention will be understood by the following description and will also be appreciated by the embodiments of the invention more clearly. Further, the objectives and advantages of the invention will readily be seen that they can be realized by the means and its combination specified in the claims.
Advantageous Effects
[11] As described so far, in case where the present invention with the structure, operation and preferred embodiments is applied to an analog temperature control method, it can effectively control the temperature to increase very quickly by removing the switching means and fundamentally solve the problems which arise from the malfunction of the switching circuit to thereby remove overheating problem.
[12] Additionally, in case where the present invention is used in a digital temperature control method, it can measure the temperature data very precisely (within 30C) when it is built in the same position all the time. Thus, the temperature control can be made digitally, so that heaters requiring high precision temperature control can remarkably improve their performances.
[13] Moreover, the present invention can be advantageously employed in ceramic heaters in various shapes such as a plate shape (circular and rectangular), cylindrical, cubic structure and the like.
[14] While the present invention has been described with reference to the particular illustrative embodiments, it is not to be restricted by the embodiments but only by the appended claims. It is to be appreciated that those skilled in the art can change or modify the embodiments without departing from the scope and spirit of the present invention. Brief Description of the Drawings [15] FIG. 1 illustrates a ceramic heater according to one preferred embodiment of the present invention; and
[16] FIG. 2 illustrates a ceramic heater according to another preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
[17] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to accompanying drawings.
[18]
[19] Embodiment 1
[20] Referring to FIG. 1, the ceramic heater of a first embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, a temperature sensor circuit 12 located between the predefined patterns of the heating circuit 14, and a second board 16 layered on the first board 10.
[21] The temperature sensor circuit 12 and the heating circuit 14 are formed in predetermined patterns on the upper portion of the first board 10. Here, the temperature sensor circuit 12 and the heating circuit 14 can be formed directly on the upper portion of the first board 10 through a screen-printing technique, or one of the patterns of either the temperature sensor circuit 12 or the heating circuit 14 can be formed on the upper portion of the first board 10 by a semiconductor process such as photolithography, and then materials of the heating circuit or the temperature sensor circuit are subjected to a process such as deposition. Thereafter, the pattern of the remaining temperature sensor circuit or heating circuit is formed on the upper portion of the second board 16 by a photolithographic technique in the same manner followed by being deposited.
[22] In addition, although FIG. 1 illustrates the first board 10 and the second board 16 in a rectangular plate shape, they may be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
[23] In FIG. 1, a non-described reference numeral 20 denotes a wire.
[24] More specifically, the ceramic heater of the structure as described above has the temperature sensor circuit 12 arranged between the patterns of the heating circuit 14, to help the temperature sensor circuit 12 accurately sense the heating temperature so that a user can precisely control the heating temperature of the ceramic heater.
[25] The heating circuit 14 and the temperature sensor circuit 12 receive electric power through the wire 20 that is separately connected for heating, and then output the sensed heating temperature to a controller (not shown).
[26] The heating circuit 12 used in the present invention is made of Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy or a mixture of these. The temperature sensor circuit is made of heating materials such as Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof, NTC thermistor materials, PTC thermistor materials, Pt, or a mixture thereof. Here, examples of the NTC thermistor materials include Mn, CO, Ni, Fe and the like. Examples of the PTC thermistor materials include BaTiCβ, Y, Ce, La, Sn and the like.
[27]
[28] Embodiment 2
[29] As shown in FIG. 2, the ceramic heater according to a second embodiment of the present invention includes a first board 10, a heating circuit 14 formed in a predetermined pattern on an upper portion of the first board 10, an intermediate board 18 layered on the first board 10, a temperature sensor circuit 12 formed in a predetermined pattern on an upper portion of the intermediate board 18, and a second board 16 layered on the intermediate board 18.
[30] The heating circuit 14 and the temperature sensor circuit 12 are formed in predetermined patterns on the upper portion of the first board 10 and the intermediate board 18, respectively. As in the first embodiment, the temperature sensor circuit 12 and the heating circuit 14 are formed by screen-printing or photolithography and deposition.
[31] Further, similar to the ones in the first embodiment, the first board 10, the intermediate board 18 and the second board 16 are in a rectangular plate shape as depicted in FIG. 2, but they can be in diverse plate shapes or cubic structures like cylinder shapes, which can be applied to all shapes of ceramic heaters.
[32] In the ceramic heater having the structure described above, the temperature sensor circuit 12 and the heating circuit 14 are formed on their respective boards 10 and 18. However, the heating circuit 14 receives electric power through a wire 20 which is separately connected for heating, and the temperature sensor circuit 12 outputs a sensed heating temperature to a controller (not shown) through the wire 20.
[33] In addition, unlike the first embodiment, the temperature sensor circuit 12 is closely adhered to the heating circuit 14 having the board 18 being in the middle, so it is not directly affected by heat generated by the heating circuit 14, thereby preventing any damage from the heat.

Claims

Claims
[ 1 ] A ceramic heater comprising: a first board; a second board layered on the first board; and a heating circuit and a temperature sensor circuit, each being positioned between the first board and the second board. [2] The ceramic heater according to claim 1, wherein the heating circuit is formed in predetermined patterns on an upper portion of the first board and the temperature sensor circuit is formed between the patterns of the heating circuit. [3] The ceramic heater according to claim 1, wherein the heating circuit is formed in predetermined patterns on a lower portion of the second board, and the temperature sensor circuit is formed between the patterns of the heating circuit. [4] The ceramic heater according to claim 1, wherein the heating circuit and the temperature sensor circuit are formed by screen printing. [5] The ceramic heater according to claim 1, wherein the heating circuit and the temperature sensor circuit are formed by a photolithography process and a deposition process. [6] The ceramic heater according to claim 1, wherein the heating circuit is formed of one of Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof. [7] The ceramic heater according to claim 1, wherein the temperature sensor circuit is made of one of heating materials such as Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof, NTC thermistor materials including
Mn, CO, Ni, Fe, PTC thermistor materials including BaTiCβ, Y, Ce, La, Sn, and
Pt and a mixture thereof. [8] The ceramic heater according to claim 1, wherein the first board and the second board on which the heating circuit and the temperature sensor circuit are formed are in a plate shape or cylinder shape. [9] A ceramic heater comprising: a first board; an intermediate board layered on the first board; a second board which is layered on the intermediate board; a heating circuit positioned between the first board and the second board; and a temperature sensor circuit positioned between the first board and the second board. [10] The ceramic heater according to claim 9, wherein the intermediate board is positioned between the first board and the second board, and made in a single layer or multiple layers. [11] The ceramic heater according to claim 9, wherein the heating circuit is formed in predetermined patterns on the upper portion of the first board, and the temperature sensor circuit is formed on one side of the intermediate board in a manner not to face the upper portion of the first board. [12] The ceramic heater according to claim 9, wherein the heating circuit is formed in predetermined patterns on the lower portion of the second board, and the temperature sensor circuit is formed on one side of the intermediate board in a manner not to face the lower portion of the second board. [13] The ceramic heater according to claim 9, wherein the temperature sensor circuit is formed in predetermined patterns on the upper portion of the first board, and the heating circuit is formed on one side of the intermediate board in a manner not to face the upper portion of the first board. [14] The ceramic heater according to claim 9, wherein the temperature sensor circuit is formed in predetermined patterns on the lower portion of the second board and the heating circuit is formed on one side of the intermediate board in a manner not to face the lower portion of the second board. [15] The ceramic heater according to claim 9, wherein the heating circuit and the temperature sensor circuit are formed by screen printing. [16] The ceramic heater according to claim 9, wherein the heating circuit and the temperature sensor circuit are formed by a photolithography process and a deposition process. [17] The ceramic heater according to claim 9, wherein the heating circuit is formed of one of Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof. [18] The ceramic heater according to claim 9, wherein the temperature sensor circuit is made of one of heating materials such as Pt, W, Mo, Ni, Ta, SiC, MoSi2 Ni-Cr alloy, Fe-Cr alloy and a compound thereof, NTC thermistor materials including
Mn, CO, Ni, Fe, PTC thermistor materials including BaTiCβ, Y, Ce, La, Sn, and
Pt and a mixture thereof. [19] The ceramic heater according to claim 9, wherein the first and the second boards on which the heating circuit and the temperature sensor circuit are formed are in a plate shape or cylinder shape.
PCT/KR2006/003570 2005-09-08 2006-09-08 Ceramic heater WO2007029981A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050083532A KR100782063B1 (en) 2005-05-24 2005-09-08 Ceramic Heater
KR10-2005-0083532 2005-09-08

Publications (1)

Publication Number Publication Date
WO2007029981A1 true WO2007029981A1 (en) 2007-03-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
WO (1) WO2007029981A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013120786A1 (en) * 2012-02-16 2013-08-22 Webasto SE Method for producing a vehicle heater and vehicle heater
WO2013120767A1 (en) * 2012-02-16 2013-08-22 Webasto SE Vehicle heater and method for producing a vehicle heater
CN103874245A (en) * 2014-03-27 2014-06-18 福建闽航电子有限公司 Bonding pad structure of ceramic heating piece with temperature control
CN105554923A (en) * 2015-12-14 2016-05-04 福建闽航电子有限公司 Method for making MCH electric heating substrate
JP2017117525A (en) * 2015-12-21 2017-06-29 京セラ株式会社 heater
US20200163428A1 (en) * 2017-05-03 2020-05-28 Jemella Limited Barrel for hair styling appliance
RU2768239C2 (en) * 2017-10-30 2022-03-23 Кейтиэндджи Корпорейшн Aerosol generating device with heater

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Publication number Priority date Publication date Assignee Title
JPH0521135A (en) * 1991-07-12 1993-01-29 Toshiba Lighting & Technol Corp Ceramic heater
JPH09106882A (en) * 1995-10-12 1997-04-22 Canon Inc Temperature control mechanism of ceramic heater
JP2003215955A (en) * 2002-12-04 2003-07-30 Harison Toshiba Lighting Corp Fixation heater, fixation device, and image forming apparatus
US20040022210A1 (en) * 2002-08-01 2004-02-05 Frank Edward H. Cooperative transceiving between wireless interface devices of a host device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521135A (en) * 1991-07-12 1993-01-29 Toshiba Lighting & Technol Corp Ceramic heater
JPH09106882A (en) * 1995-10-12 1997-04-22 Canon Inc Temperature control mechanism of ceramic heater
US20040022210A1 (en) * 2002-08-01 2004-02-05 Frank Edward H. Cooperative transceiving between wireless interface devices of a host device
JP2003215955A (en) * 2002-12-04 2003-07-30 Harison Toshiba Lighting Corp Fixation heater, fixation device, and image forming apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013120786A1 (en) * 2012-02-16 2013-08-22 Webasto SE Method for producing a vehicle heater and vehicle heater
WO2013120767A1 (en) * 2012-02-16 2013-08-22 Webasto SE Vehicle heater and method for producing a vehicle heater
CN104115552A (en) * 2012-02-16 2014-10-22 韦巴斯托股份公司 Method for producing a vehicle heater and vehicle heater
CN104137647A (en) * 2012-02-16 2014-11-05 韦巴斯托股份公司 Vehicle heater and method for producing a vehicle heater
US20150014295A1 (en) * 2012-02-16 2015-01-15 Dietmar Bytzek Vehicle heater and method for producing a vehicle heater
US10112457B2 (en) 2012-02-16 2018-10-30 Webasto SE Method for producing a vehicle heater and vehicle heater
US10555378B2 (en) 2012-02-16 2020-02-04 Webasto SE Vehicle heater and method for producing a vehicle heater
CN103874245A (en) * 2014-03-27 2014-06-18 福建闽航电子有限公司 Bonding pad structure of ceramic heating piece with temperature control
CN105554923A (en) * 2015-12-14 2016-05-04 福建闽航电子有限公司 Method for making MCH electric heating substrate
JP2017117525A (en) * 2015-12-21 2017-06-29 京セラ株式会社 heater
US20200163428A1 (en) * 2017-05-03 2020-05-28 Jemella Limited Barrel for hair styling appliance
RU2768239C2 (en) * 2017-10-30 2022-03-23 Кейтиэндджи Корпорейшн Aerosol generating device with heater

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